Korea Advanced Institute of Science and Technology

Skc Co., Ltd.

Information and Communications University, Research and Industrial Cooperation Group

Kaist

Information and Communication Univerity Research and Industrial Cooperation Group

Hyo Hoon Park

Tae Woo Lee

Jong Hun Kim

Sun Kyu Han

Mu Hee Cho

Seong Woon Kim

Min Hyuk Lee

Jong Ho Lee

Hyeon Min Bae

Kyung Rok Kim

Han Seo Cho

Do Won Kim

Suk Min Seo

Sae Kyong Kang

Ji Hwan Park

Dong Min Im

A photonic radiator device forming a photonic phased array antenna includes a light waveguide including a waveguide clad and a waveguide core using a semiconductor material, and a grating periodically formed an upper or lower part of the light waveguide. The photonic radiator device receives an input light wave in a direction of the grating and the light waveguide and radiates an output light wave to a space by using scattering from the grating.

Nanophotonic radiator using grid structure for application to photonic phased-array antenna

Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.

First EM-tunnel embedded in a first PCB and free space coupled to a second EM-tunnel embedded in a second PCB

Disclosed is a device which constitutes a photonic phased array antenna. The device includes at least one light source, an optical power distributor configured to distribute a light wave generating from the light source, a phase controller configured a phase of the light wave, and a light wave radiator configured to radiate the light wave into a space based on the controlled phase. Optical waveguides are connected between the light source and the optical power distributor, between the optical power distributor and the phase controller and between the phase controller and the light wave radiator, respectively.

Photonic phased array antenna

A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

Chip packaging method and chip package using hydrophobic surface

A waveguide of a 3D interconnection structure and an optical data bus system of a 3D interconnection structure using the same are provided. The waveguide includes a main waveguide which is formed in a predetermined direction and at least one branch waveguide which connects to the main waveguide to form a predetermined angle, wherein the at least one branch waveguide branches an optical signal, which is propagated in the main waveguide, at a predetermined rate.

3-dimensional optical interconnection structure using branched waveguides

An optical input/output (I/O) bus system for connecting a plurality of external devices with a central processing unit (CPU) or memory in a specific system using an optical signal is provided. The optical I/O bus system includes a serializer and deserializer (SerDes) connected with the CPU or memory, and configured to divide a serial electrical signal into parallel electrical signals or combine parallel electrical signals into a serial electrical signal, a photoelectric converter prepared between the SerDes and the external devices, and configured to convert the serial/parallel electrical signals into an optical signal or an optical signal into an electrical signal, a plurality of optical transmission means disposed in parallel to transfer the optical signal converted by the photoelectric converter, an optical switch prepared between the photoelectric converter and the optical transmission means, and configured to switch to one of the optical transmission means to transfer the optical signal converted by the photoelectric converter to the optical transmission means according to an address of the optical signal, and a plurality of optical slots connected to the respective optical transmission means to connect the external devices so that the optical signal is input/output. In the optical I/O bus system, a high-capacity signal can be transferred without distortion, interference, and bottleneck using optical connection technology.

Optical I/O bus system

An optical interconnection system is provided and includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, a one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB.

Optical interconnection system using optical printed circuit board having one-unit optical waveguide integrated therein

A USB compatible apparatus for connecting an optical universal serial bus (USB) (or an optical serial bus; OSB) device and an electrical USB device, and a structure of the apparatus are provided. More particularly, a USB compatible apparatus for guaranteeing a connection between an optical USB device for inputting/outputting an optical signal and an electrical USB device for inputting/outputting an electrical signal, for example, signal transmission and reception between an electrical USB device (e.g., an electrical USB memory) and an optical USB device (e.g., a computer) having an optical USB port, and a structure of the USB compatible apparatus (a first exemplary embodiment), and a USB compatible apparatus for guaranteeing signal transmission and reception between an optical USB device (e.g., an optical USB memory) and an electrical USB device (e.g., a portable telephone) having an electrical USB port, and a structure of the USB compatible apparatus (a second exemplary embodiment) are provided.

USB compatible apparatus for connecting between optical USB device and electrical USB device

Disclosed herein is an optical interconnecting system for transmitting a large amount of data. The system includes a bidirectional transmitting/receiving circuit that is installed at each of both ends of a data line between chips or boards, selectively receives an electric signal or an optical signal, amplifies and converts the received signal and selectively outputs the signal. The optical interconnecting system integrates a transmitter and a receiver into one bidirectional transmitting/receiving circuit to reduce circuit design and manufacturing costs and decrease power consumption. The system can integrate the bidirectional transmitting/receiving circuit in a highly integrated semiconductor chip and extend it to a multi-dimension multi-channel form to produce a compact package. Moreover, the system can freely select an electric signal or an optical signal as input/output signal forms at input/output stages using the select switches of the bidirectional transmitting/receiving circuit and thus the system can be applied to various applications.

Bidirectional optical signal transmitting and receiving system with a single main amplifier

Disclosed is an optical printed circuit board (PCB) having a multi-channel optical waveguide, which comprises: an optical waveguide having an optical path for transmitting light beams; a groove for penetrating the optical waveguide; and an optical interconnection block inserted in the groove and connected to the optical waveguide to transmit the light beams, wherein the optical interconnection block includes an optical fiber bundle bent by the angle of 90&#xb0;. The optical interconnection block connects a plurality of multi-layered optical waveguides to transmit light beams to the optical waveguides. The optical fiber bundle is installed as a medium of the multi-channel optical waveguide in the optical PCB.

Growing community of inventors

Daejeon, South Korea

Hyo Hoon Park