Lumens Co., Ltd.

Hyo Gu Jeon

Seung Hyun Oh

Jung Hyun Park

Bo Gyun Kim

Yun Geon Cho

Suk Min Han

Jun Hyeok Han

Chi Gyun Song

Dae Gil Jung

Jung Hye Park

The present invention relates to a light emitting element package with a thin film pad and a manufacturing method thereof, and more particularly, to a light emitting element package with a thin film pad, which mounts and molds a light emitting diode on a thin film pad formed on a substrate and then, separates the light emitting diode from the substrate and configures a light emitting element package to effectively suppress occurrence of defective soldering or the like by securing a sufficient pad area and shape required for soldering by using the thin film pad while implementing a small light emitting element package such as a chip scale package or the like and a manufacturing method thereof. Disclosed is a light emitting element package including: a plurality of light emitting diodes having a first electrode pad and a second electrode pad at a lower portion thereof; a thin film pad having the plurality of light emitting diodes mounted thereon and constituted by one common thin film pad and a plurality of individual thin film pads; and a molding layer molding the plurality of light emitting diodes and the thin film pad, in which a lower surface of the thin film pad has a light emitting element package soldering region for soldering the light emitting element package, and an area of the light emitting element package soldering region is larger than that of each of the first electrode pad and the second electrode pad of the light emitting diode.

Light emitting element package with thin film pad and manufacturing method thereof

LED package

Disclosed herein is a light emitting device package and a light emitting device package module. The light emitting device package includes: a base including a cavity; a first light emitting device disposed in the cavity, the first light emitting device including a first light emitting element configured to produce light having a first peak wavelength and a first fluorescent layer covering a top and side surfaces of the first light emitting element; and a second light emitting device disposed in the cavity, the second light emitting device including a second light emitting element configured to produce light having a second peak wavelength and a second fluorescent layer covering a top and side surfaces of the second light emitting element, wherein the first fluorescent layer is configured to convert the light having the first peak wavelength of the first light emitting element to light having a third peak wavelength, and the second fluorescent layer is configured to convert the light having the second peak wavelength of the second light emitting element to light having a fourth peak wavelength.

Light emitting device package and light emitting device package module

Growing community of inventors

Yongin-si, South Korea

Hyo Gu Jeon