Apple Inc.

Kateeva, Inc.

Other

Hyeun-Su Kim

Dariusz Golda

Valerie Gassend

Andreas Bibl

John A Higginson

Chae Hyuck Ahn

James Michael Perkins

Stephen Paul Bathurst

Antoine Manens

Clayton K Chan

Sumant Sood

Eric B Newton

Kevin T Huang

Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

High density pick and sequential place transfer process and tool

Donor substrate micro device stabilization structures and display structures are described. In an embodiment, a patterned electrically conductive layer is used to stabilize an array of micro devices on donor substrate with a plurality of tethers, which can be broken during a transfer sequence to transfer the array of micro devices from the donor substrate.

Nano-tether micro LED structure

An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.

Electrostatic cleaning device

Metal-to-metal adhesion joints are described as a manner to hold down micro devices to a carrier substrate within the context of a micro device transfer manufacturing process. In accordance with embodiments, the metal-to-metal adhesion joints must be broken in order to pick up the micro devices from a carrier substrate, resulting in micro devices with nubs protruding from bottom contacts of the micro devices. Once integrated, the micro devices are bonded to a receiving substrate, the nubs may be embedded in a metallic joint, or alternatively be diffused within the metallic joint as interstitial metallic material that is embedded within the metallic joint.

Micro device metal joint process

A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.

Pick and place device with interdigitated electrodes for micro scale device

The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead.

Modular printhead for OLED printing

A thermal printhead die is formed from an SOI structure as a MEMS device. The die has a printing surface, a buried oxide layer, and a mounting surface opposite the printing surface. A plurality of ink delivery sites are formed on the printing surface, each site having an ink-receiving and ink-dispensing structure. An ohmic heater is formed adjacent to each structure, and an under-bump metallization (UBM) pad is formed on the mounting surface and is electrically connected to the ohmic heater, so that ink received by the ink-delivery site and electrically heated by the ohmic heater may be delivered to a substrate by sublimation. A through-silicon-via (TSV) plug may be formed through the thickness of the die and electrically coupled through the buried oxide layer from the ohmic heater to the UBM pad. Layers of interconnect metal may connect the ohmic heater to the UBM pad and to the TSV plug.

Growing community of inventors

Palo Alto, CA, United States of America

Hyeun-Su Kim