Korea Institute of Science and Technology

Hyeonuk Yeo

Nam Ho You

Munju Goh

Bon-Cheol Ku

Sang Jun Youn

Young Soo Kim

Seokhoon Ahn

Jin Young Jung

Se Gyu Jang

Jun Kyung Kim

Jin Won Yu

Young Bum Hong

Chiyoung Park

Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.

Liquid crystalline epoxy compound with terminal mesogen connected by flexible linkage and method for preparing the same

A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOY(wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1&#x2264;m&#x2264;8 and n is a number satisfying 1&#x2264;n&#x2264;6), and a reaction solvent, wherein X is capable of being dissociated from XOYand Y radical is capable of being produced from XOYin the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200&#xb0; C., specifically 100&#xb0; C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.

Method and composition for depolymerization of cured epoxy resin materials

For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200&#xb0; C., specifically 100&#xb0; C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.

Composition and method for depolymerization of cured epoxy resin materials using transition metal salts

Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.

Transparent and heat-insulating material including polymer capsule and method for preparing the same

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Wanju-gun, South Korea

Hyeonuk Yeo