Samsung Electronics Co., Ltd.

Hyeonok Jung

Kiseok Lee

Sunghee Han

Yoosang Hwang

Keunnam Kim

Chan-Sic Yoon

Dongoh Kim

Bongsoo Kim

Hyosub Kim

Euna Kim

Chansic Yoon

Jiung Pak

Jemin Park

Wonwoo Lee

Jay-Bok Choi

Yongseok Ahn

Beomyong Hwang

Inseok Baek

Byunghoon Cho

A transistor with a shared gate structure includes an active area and a gate. The active area has a body extending in a first direction on a substrate, and a protrusion extending in a second direction perpendicular to the first direction from a central portion of the body in the first direction. The gate is arranged above the active area to overlap a channel area of the active area, and has an inverted pi () structure that, from a plan view, surrounds on three sides but does not cover a portion of the active area that includes two corner portions of the active area. The active area is divided into a first active area and a second active area by a separation area extending in the second direction and separating the body and a portion of the protrusion. The protrusion is divided into a first portion separated into two sub-portions by the separation area and a second portion, wherein the first portion is between the body and the second portion in the second direction. Opposite ends of the body in the first direction corresponding to two drain areas, the second portion of the protrusion corresponding to a common source area, and the gate constitute two transistors, wherein the two transistors share the gate.

Transistor unit including shared gate structure, and sub-word line driver and semiconductor device based on the same transistor unit

A semiconductor device includes: an active region defined by a device isolation layer formed in a substrate; a word line configured to cross the active region, the word line extending in a first direction and being formed in the substrate; a bit line extending in a second direction perpendicular to the first direction on the word line; a first contact connecting the bit line to the active region; a first mask for forming the active region, the first mask being formed on the active region; and a second mask of which a height of a top surface thereof is greater than a height of a top surface of the active region, the second mask covering the word line, wherein the active region has a bar shape that extends to form an acute angle with respect to the first direction.

Semiconductor and manufacturing method of the same

Semiconductor device and manufacturing method of the same

A semiconductor device includes a substrate having an active pattern, a cell region on the substrate and having a cell circuit, and a core region on the substrate having a peripheral circuit. In plan view, the active pattern on the core region includes a plurality of corners. Each of the corners has a rounding index that is equal to or less than about 15 nm. The rounding index is a distance between a respective tip of each of the corners and a right-angled corner.

Semiconductor device

A method of fabricating a semiconductor device includes forming a linear preliminary mask pattern in a first direction on a substrate. The preliminary mask pattern is patterned to provide a plurality of mask patterns that are aligned end-to-end with one another on the substrate and are separated by an exposed portion of the substrate between respective facing ends of the plurality of mask patterns. An auxiliary layer is formed to cover at least sidewalls of the facing ends to reduce a size of the exposed portion to provide a reduced exposed portion of the substrate and the reduced exposed portion of the substrate is etched to form a trench defining active patterns in the substrate aligned end-to-end with one another.

Semiconductor devices using auxiliary layers for trimming margin and devices so formed

Methods of forming semiconductor devices using auxiliary layers for trimming margin

A semiconductor device includes a semiconductor substrate including active portions including first and second dopant regions, word lines on the substrate and extending in a first direction to intersect the active portions, first and second bit lines on the substrate and extending in a second direction to intersect the word lines, and contact structures in regions between the word lines and between the first and second bit lines when viewed from a plan view. The first and second bit lines are connected to the first dopant regions. The contact structures are in contact with the second dopant regions, respectively. The contact structures each include a contact plug and a contact pad. The contact pads contact the second dopant regions. A separation distance between the contact plugs and the first bit lines is less than separation distance between the contact pads and the first bit lines.

Semiconductor device and method for manufacturing the same

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Daejeon, South Korea

Hyeonok Jung