Samsung Electronics Co., Ltd.

Hyeon Uk Kim

Chul Hong Park

Byung Sung Kim

Yubo Qian

Young Gook Park

A semiconductor device includes a first conductive element, a first insulating layer and a second insulating layer sequentially disposed on the first conductive element, a conductive via passing through the first insulating layer and the second insulating layer. The conductive via is connected to the first conductive element. The semiconductor device includes a via extension portion disposed in the second insulating layer that extends along an upper surface of the first insulating layer from one side surface of the conductive via, and a second conductive element disposed on the second insulating layer that is connected to the via extension portion.

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Seoul, South Korea

Hyeon Uk Kim