Hyundai Motor Company

Kyung Chang Industrial Co., Ltd.

Kia Corporation

Kia Motors Corporation

Hyeon Uk Kim

Eun Sik Kim

Ji Soo Kim

Jun Hee Park

Kyung Nam Kim

Sung Il Byun

Jong Hwan Han

Sung Won Park

Hyun Koo Lee

Dae Yeon Kim

Gyu Yeong Choe

Bum Sik Kim

Jin Hwan Jung

Ki Young Jang

Myung Ill You

Tae Hwa Kim

Jong Hee Han

Beom Jun Kim

Ki Chul Hyun

A power module and a manufacturing method includes a chip; an upper substrate provided above the chip and formed with a circuit pattern; a lower substrate provided below the chip and formed with a circuit pattern; and a spacer including a plurality of metal portions electrically connecting at least two among the chip, the upper substrate and the lower substrate to transmit an electrical signal, and an insulating portion positioned between the plurality of metal portions and insulating the metal portions.

Power module and manufacturing method thereof

An electronic pedal apparatus may be operated by a driver with a small force. When the driver operates a pedal pad, the pedal pad is operated with a fine displacement, but a change in a pedal force is increased through compression of a return spring using a rotation lever and a spring guide, so that the driver is capable of easily recognizing an operation situation of a pedal. Furthermore, safety during operation of the pedal may be more enhanced by using a dual sensing structure in which first and second permanent magnets and first and second printed circuit boards (PCBs) are used.

Electronic pedal apparatus

A double-sided cooling type power module according to the present invention includes: an upper substrate including an insulating layer, an upper metal layer bonded to a top of the insulating layer, and a lower metal layer bonded to a bottom of the insulating layer; a lower substrate disposed under the upper substrate and including an insulating layer, an upper metal layer bonded to a top of the insulating layer, and a lower metal layer bonded to a bottom of the insulating layer; a spacer disposed between the upper substrate and the lower substrate and electrically connecting the upper substrate and the lower substrate; and a semiconductor chip disposed between the spacer and the upper substrate or the lower substrate, in which the insulating layers are made of a material of which a coefficient of thermal expansion is 0.8 or more and 1.2 or less times of coefficients of thermal expansion of the metal layers of the upper substrate and the lower substrate.

Double-sided cooling type power module

A foldable pedal device for vehicles enables an accelerator pedal module and a brake pedal module, which have different pop-up strokes, to be simultaneously popped up and hidden by operation of one actuator module and blocks introduction of moisture and foreign substances by shielding a gap between a footrest panel and the pedal module using a shield membrane.

Foldable pedal device for vehicles

An electronic pedal apparatus, in which a driver may operate the electronic pedal apparatus with a small effort, may operate by fine displacement when the driver operates a pedal pad, but a spring module is displaced by being pressed by the pedal pad and displaced by being pressed by a rotation lever so that a large change in pedal effort may be implemented, and safety during an operation of a pedal may be further improved by use of a dual detecting structure using first and second permanent magnets and first and second PCBs.

An embodiment system for charging an electric motor vehicle includes a first switching circuit configured to select one of at least two chargers, a second switching circuit configured to select a charging station connector to be connected to the charger selected by the first switching circuit, and a controller configured to control the first switching circuit and the second switching circuit based on a predetermined charging order to allow charging of a battery of a vehicle that is connected to the charging station connector to be performed, sense connection of a charging connector of the vehicle to the charging station connector, receive a required charging amount and an available waiting time of the vehicle, and determine the charging order based on the required charging amount and the available waiting time.

System and method for charging electric motor vehicle

An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal spreader of a plurality of inner thermal spreader is inserted into the inner metal layer.

Insulating substrate and power module using the same

A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

Power module and method of manufacturing the same

A pedal apparatus for a vehicle, includes a pedal pad rotatably coupled to an upper end portion of a foldable pedal arm so that a contact area may be increased when a driver's foot comes into contact with the pedal pad, which makes it possible to improve convenience and safety for the driver when the driver performs the pedal operation.

Pedal apparatus for vehicle

A pedal apparatus for a vehicle, may include a brake pedal assembly, an accelerator pedal assembly, and a footrest panel are assembled to one another to form a single module component, and the completely assembled module component is supplied to an assembling line for a vehicle and assembled to a dash panel which is a vehicle body.

A foldable accelerator pedal apparatus for a vehicle includes: a pedal housing fixedly installed in a lower space of a driver seat, a pedal pad rotatably coupled to the pedal housing, and a hysteresis module to generate hysteresis when a driver manipulates the pedal pad. In a manual driving mode in which a driver directly drives the vehicle, the pedal padprotrudes from the pedal housingand is popped up to be exposed to the driver, and in an autonomous driving mode in which the driver does not directly drive the vehicle, the pedal padis inserted into the pedal housingand is in a hidden (hide) state in which the exposure to the driver is blocked. It is possible to implement hysteresis through the hysteresis modulewhen the pedal padis manipulated.

Foldable accelerator pedal apparatus for vehicle with hysteresis module

The present disclosure relates to an organ-type electronic pedal apparatus including a high-load spring module 500 and a hysteresis lever 400 and capable of tuning a pedal effort, a stroke, and a hysteretic force, which are required to vary depending on the types of vehicles, by changing components of the hysteresis lever 400, as necessary.

Organ-type electronic pedal apparatus

An organ-type electronic pedal device includes a high-load spring module and a hysteresis lever. If necessary, the organ-type pedal device enables different pedal efforts, strokes, and hysteresis operating forces to be tuned as required for individual vehicle models by changing the parts of the hysteresis lever.

Organ-type electronic pedal device

An organ-type electronic pedal apparatus includes a high-load spring module and a hysteresis lever and configured for tuning a pedal effort, a stroke, and a hysteretic force, which are required to vary depending on the types of vehicles, by changing components of the hysteresis lever, as necessary.

An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal diffusion inductor of a plurality of inner thermal diffusion inductors is inserted into the inner metal layer.

Growing community of inventors

Daegu, South Korea

Hyeon Uk Kim