Skhynix Inc.

Hyeon Ji Baek

Jong Hyun Kim

Ki Yong Lee

Hyung Ju Choi

Yeon Ji Park

Mun Aun Hyun

A semiconductor package includes a semiconductor chip electrically connected to a substrate, and a molding part including first molding members and second molding members arranged in an alternating pattern. The first molding members have a first physical flexibility which is different from a second physical flexibility of the second molding members.

Semiconductor packages and methods of fabricating the same

A semiconductor module comprising a plurality of semiconductor chips where at least one semiconductor chip is laterally offset with respect to a second semiconductor chip, and substantially aligned with a third semiconductor chip such that an electrical connection can be made between an electrical contact in the first semiconductor chip and an electrical contact in the third semiconductor chip.

Growing community of inventors

Icheon-si, South Korea

Hyeon Ji Baek