Samsung Electronics Co., Ltd.

Hyeon-hyang Kim

Eun-bong Han

Keon Kuk

Yeon-kyoung Jung

Young-dae Ko

O-hyun Beak

Jun-hee Lee

Il-ju Mun

Eun-Bong Han

Young-Dae Ko

Il-Ju Mun

An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Object forming apparatus and controlling method thereof

A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Circuit element package, manufacturing method thereof, and manufacturing apparatus thereof

An electromagnetic interference shielding structure is disclosed. The electromagnetic interference shielding structure includes an insulating member covering at least one circuit element mounted on a printed circuit board (PCB), a shielding member covering the insulating member, and a heat dissipator having a surface adhering to the shielding member to transfer heat emitted from the at least one circuit element to a place where temperature is relatively low.

EMI shielding structure having heat dissipation unit and method for manufacturing the same

Growing community of inventors

Seoul, South Korea

Hyeon-hyang Kim