Samsung Display Co., Ltd.

Samsung Electronics Co., Ltd.

Hyeon Deuk Hwang

Hyung-Don Na

Ki-Kwon Jeong

Dong Yeon Lee

So Yeon Joo

Jungkyu Jo

Eunjoong Mun

Su Kyoung Kim

Yunjeong Cho

Kyunghoon Chae

Jongho Lee

Daewoo Lee

Sung Soo Lee

Jong Man Bae

Pyoung-Wan Kim

Se Hun Park

Taewook Kim

Tae-Sung Yoon

Dohyung Ryu

Han Ho Park

Dong-Kuk Kim

Ji Young Wang

Hyun Hee Lee

Chang Mo Park

Jong Hwan Cho

Kyung Jun Park

Hyung Don Na

Jeongjoon Oh

Eun Joong Mun

Je Yoon Yoo

Simhee Ryu

Chang Seob Jung

Eun Ji Park

A display module includes a base layer including a first portion including a light emitting device, a second portion including a circuit board electrically connected to the second portion, and a third portion disposed between the first portion and the second portion, the third portion being bent, a light emitting device layer overlapping the first portion in a plan view and disposed on an upper surface of the first portion of the base layer, a protective film disposed on a lower surface of the base layer, the protective film including an opening overlapping the third portion of the base layer in a plan view, and a first protective layer disposed on a lower surface of the third portion and overlapping the opening of the protective film in a plan view, wherein a modulus of the first protective layer is about 10Pa or higher than about 10Pa.

Display module and manufacturing method of the same

A manufacturing method of a display device includes providing a display module including a display panel, a first flexible circuit board disposed at a first side edge of the display panel, a window disposed on the display panel, and an optical film disposed between the display panel and the window on the stage; aligning the display module such that the first side edge is disposed under the bonding unit; moving the position detection sensor along the first side edge of the display module to sense a first coating path; moving the resin supply unit along the sensed first coating path to coat a first filling agent between the window and the display panel; and moving the light irradiation unit along the sensed first coating path to cure the coated first filling agent to form a first filling layer.

Display device, apparatus for manufacturing the same, and method of manufacturing the display device

A semiconductor package includes a package substrate; a plurality of lower chip structures on the package substrate; an upper chip structure on the plurality of lower chip structures and covering portions of upper surfaces of the plurality of lower chip structures; a non-conductive adhesive layer on a lower surface of the upper chip structure and receiving upper portions of the plurality of lower chip structures; and a molded member on the plurality of lower chip structures and the upper chip structure.

Semiconductor packages with chips partially embedded in adhesive

A display device including a display panel having a first surface and a second surface opposite to the first surface, a guide structure disposed on the first surface of the display panel, and a window disposed on the second surface of the display panel, in which the guide structure includes a guide film configured to apply a preliminary pressure to the display panel, and a cover panel disposed between the guide film and the display panel, the cover panel including a cushion layer.

Display device, method of manufacturing display device, and guide structure used therein

A display device includes a display panel including a display area and a non-display area, a window disposed on the display panel and including a base substrate and a printed layer disposed on a surface of the base substrate and overlapping with the non-display area, and an adhesive layer disposed between the display panel and the window. The adhesive layer includes a first adhesive portion overlapping with the non-display area, and a second adhesive portion adjacent to the first adhesive portion and having a creep value different from a creep value of the first adhesive portion.

Display device and method for manufacturing the same

A method of measuring adhesive strength includes setting an evaluation time (t), fixing a substrate and an adhesive member to a measurement device, pulling the adhesive member fixed to the measurement device with a first measurement force (F) for the evaluation time (t), pulling the adhesive member fixed to the measurement device is pulled with a second measurement force (F), which is obtained by increasing the first measurement force (F) by a preset amount, for the evaluation time (t), and determining a reference measurement force (F) which is a static force applied to the adhesive member when a distance by which a first portion of the adhesive member is detached from the substrate is equal to a preset distance (d) is determined.

Method of measuring adhesive strength

A method for evaluating a binder includes disposing the binder on a first plate, bringing a second plate, which faces the first plate, into contact with one surface of the binder, applying a stress to the binder through the second plate, measuring a strain of the binder due to the applied stress, and calculating a curing rate of the binder based on the strain of the binder.

Method for evaluating binder

A display device includes a display panel having a display area and a non-display area at least partially surrounding the display area. A panel support sheet is disposed behind the display panel and has a first hole exposing the display area of the display panel. An optical sensor is disposed within the first hole. A first light-blocking portion is disposed in a void area that is between the panel support sheet and the optical sensor, within the first hole.

Display device having an optical sensor

A method for manufacturing a display device, includes preparing a display panel including a base substrate, an encapsulation layer facing the base substrate, and an organic light emitting device formed between one surface of the base substrate and the encapsulation layer, attaching a support layer to the other surface of the base substrate through an adhesive layer, curing the adhesive layer through irradiation of UV light, and mounting a driving chip on one surface of the display panel. The adhesive layer includes an acryl-based compound, a UV curable compound, and a photoinitiator.

Method for manufacturing display device using UV curable adhesive and display device manufactured by the method

A display device, including a display panel displaying an image; a cover receiving the display panel therein; and a protective layer between the display panel and the cover and including a chromic material.

Display device and method of manufacturing the same

A reworking apparatus for a display module includes a chamber and a temperature control unit. The temperature control unit controls a temperature in the chamber to reduce an adhesive property of an adhesive material of the display module. The adhesive material couples a first layer of the display module to a second layer of the display module. A stage is disposed in the chamber and holds the display module. A separation unit is disposed in the chamber and is inserted in between first and second layers of the display module. A movement unit moves the separation unit.

Reworking apparatus for display module and reworking method for display module using the same

A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.

Method of forming a thin wafer stack for a wafer level package

A method may involve mounting a first supporting plate on an active surface of a wafer using an adhesive. A portion of the back surface of the wafer may be backlapped. A second supporting plate may be mounted on the back surface of the wafer using an adhesive. The first supporting plate may be removed from the active surface of the wafer. Conductive bumps may be provided on the active surface. A backlapping process may include a first grinding process, a second grinding process, and a polishing process. The first and the second supporting plates may be fabricated from a solid material. The adhesive may be an ultraviolet cure adhesive or a thermal cure adhesive.

Method for manufacturing semiconductor wafer

Provided is a method by which differently-sized chips may be stacked at the wafer level. The wafer level chip stack method utilizes first and second wafer assemblies that support first and second wafers on adhesive tapes. One or both of the supported wafers may be sawed or otherwise divided to obtain separate first and second chips that remain fixed to respective first ring frames. The first and second wafer assemblies may then be positioned and aligned so that a back surface of the second wafer faces an active surface of the first wafer. Each of the second chips may then be bonded to a corresponding first chip to form a chip stack using an adhesive layer. The chip stacks may then be detached from the wafer assemblies and attached to a substrate.

Growing community of inventors

Cheonan-si, South Korea

Hyeon Deuk Hwang