Growing community of inventors

Seongnam-si, South Korea

Hyeokshin Kwon

Average Co-Inventor Count = 2.98

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 19

Hyeokshin KwonInsu Jeon (9 patents)Hyeokshin KwonJaehyeong Lee (6 patents)Hyeokshin KwonYoungtek Oh (4 patents)Hyeokshin KwonJaeho Shin (3 patents)Hyeokshin KwonTaehwan Jang (3 patents)Hyeokshin KwonWontaek Seo (2 patents)Hyeokshin KwonJinwook Jung (2 patents)Hyeokshin KwonHwansoo Suh (1 patent)Hyeokshin KwonJinhyoun Kang (1 patent)Hyeokshin KwonSungho Han (1 patent)Hyeokshin KwonYeongtek Oh (0 patent)Hyeokshin KwonHyeokshin Kwon (11 patents)Insu JeonInsu Jeon (17 patents)Jaehyeong LeeJaehyeong Lee (6 patents)Youngtek OhYoungtek Oh (12 patents)Jaeho ShinJaeho Shin (8 patents)Taehwan JangTaehwan Jang (4 patents)Wontaek SeoWontaek Seo (61 patents)Jinwook JungJinwook Jung (11 patents)Hwansoo SuhHwansoo Suh (8 patents)Jinhyoun KangJinhyoun Kang (1 patent)Sungho HanSungho Han (1 patent)Yeongtek OhYeongtek Oh (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Samsung Electronics Co., Ltd. (11 from 131,214 patents)


11 patents:

1. 12381298 - Superconducting qubit memory of quantum computer

2. 12353956 - Active circulator and quantum computer system with active circulator

3. 12062826 - Superconducting qubit memory of quantum computer

4. 11812672 - Quantum computing device and system

5. 11574229 - Three-dimensional transmon qubit apparatus

6. 11349059 - Josephson junction device and method of manufacturing the same

7. 11245021 - Silicene electronic device

8. 10818765 - Silicene electronic device

9. 9899473 - Method of forming nanostructure, method of manufacturing semiconductor device using the same, and semiconductor device including nanostructure

10. 9882112 - Multi-qubit device and quantum computer including the same

11. 9633314 - Multi-qubit coupling structure

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as of
12/3/2025
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