Db Hitek Co., Ltd.

Hyeok In Kwon

Jong Won Sun

Han Choon Lee

Dong Chun Park

Ye Eun Na

A MEMS microphone includes a substrate presenting a vibration area, a supporting area surrounding the vibration area and a peripheral area surrounding the supporting area, the substrate defining a cavity formed in the vibration area, a lower back plate being disposed over the substrate to cover the cavity and having a plurality of lower acoustic holes, a diaphragm being disposed over the lower back plate, the diaphragm being spaced apart from the lower back plate and configured to generate a displacement thereof in response to an applied acoustic pressure, an upper back plate being disposed over the diaphragm, the upper back plate being spaced apart from the diaphragm and having a plurality of upper acoustic holes, and an intermediate anchor being in contact with an upper surface of the lower back plate in the supporting area, the intermediate anchor being configured to support the diaphragm to space the diaphragm from the lower back plate, and to provide elasticity for the diaphragm.

MEMS microphone and method of manufacturing the same

A MEMS microphone includes a first dummy pad elevating a circumferential portion of an intermediate insulation layer adjacent to a second pad electrode, a second dummy pad elevating a first circumferential portion of an upper insulation layer adjacent to the second pad electrode, and a third dummy pad elevating a second circumferential portion of the upper insulation layer adjacent to the first pad electrode. Thus the first circumferential portion of the upper insulation layer is elevated relative to an upper surface of the second pad electrode, and the second circumferential portion of the upper insulation layer is elevated relative to an upper surface of the first pad electrode.

Growing community of inventors

Gyeonggi-do, South Korea

Hyeok In Kwon