Samsung Electronics Co., Ltd.

Hyeog-Ki Kim

Sue-ryeon Kim

Chang-su Lim

Il-kyoung Kim

Yo-Han Ahn

Soo-Woong Lee

Jung-Sung Hwang

Hyun-Ho Cho

Jung-Hun Nam

Ki-Doo Kim

A wafer storage container includes a shell body including a first side body and a second side body that face, an upper body connected with upper parts of the first side body and the second side body, a rear body connected with an end of one side of each of the first side body and the second side body, and a lower body connected with lower parts of the first side body and the second side body, and configured to define an internal space together with the first side body, the second side body, the upper body, and the rear body.

Wafer storage container

A substrate processing apparatus for processing substrates prevents the substrates from contaminating as they are transferred. The apparatus includes a container, like a FOUP, for containing substrates, at least one processing chamber where the substrates are processed, a substrate transferring module including a substrate transfer chamber and at least one load port for supporting a container, and a contamination controlling system for the substrate transfer chamber. The contamination controlling system includes a purge gas supply inlet connected to the substrate transfer chamber, and a gas circulating tube for recycling the purging gas to circulate through the chamber. The substrate transfer chamber is purged using the purging gas to remove moisture and contaminating materials from the substrate transfer chamber. The formation of particles on the substrate otherwise caused by a reaction between the moisture and contaminating materials while the substrate is standing by in the container can be prevented.

Substrate processing apparatus and method of processing substrate while controlling for contamination in substrate transfer module

A dustproof fabric for use in manufacturing a smock to be worn in a clean room of a semiconductor fabrication facility includes an inner layer of a knitted fabric, an intermediate layer attached to the inner layer and formed of a non-micro porous polyurethane resin film possessing a high degree of moisture absorbency, and an outer layer attached to the intermediate layer and formed of a high density polyester woven fabric containing conductive yarn in the warp and weft.

Dustproof smock for use in a clean room, fabric for use in manufacturing the smock, and method of manufacturing the fabric

A dust-proof fabric is disclosed. The fabric comprises an inner knit fabric layer, an intermediate layer of a moisture absorbent polyurethane film and a high density woven polyester fabric outer layer. The outer layer contains a first set of spaced apart conductive yarns aligned with one another in the warp direction and a second set of spaced apart conductive yarns aligned in the weft direction.

Growing community of inventors

Seoul, South Korea

Hyeog-Ki Kim