Samsung Electronics Co., Ltd.

Hyelim Hwang

Nayoung Kim

Seongho Kim

Hoonmin Kim

Hongkyu Hwang

An upper electrode of an integrated circuit device includes a metal-containing conductive pattern disposed on a dielectric layer and that fills spaces between a plurality of lower electrodes and covers top surfaces of the plurality of lower electrodes, and a non-metal conductive pattern that includes a bottom surface in contact with a top surface of the metal-containing conductive pattern, and a top surface. The non-metal conductive pattern includes a lower non-metal conductive portion that includes a first top surface at a first height from the bottom surface, and an upper non-metal conductive portion that includes a second top surface at a second height from the bottom surface that is higher than the first height and that protrudes from the first top surface of the lower non-metal conductive portion away from the substrate. A difference between the second height and the first height is greater than the first height.

Growing community of inventors

Hwaseong-si, South Korea

Hyelim Hwang