Samsung Electronics Co., Ltd.

Hyekyeong Kweon

Sungjin Kim

Seok-ho Shin

Jaepil Lee

Joodong Kim

Dongwon Lim

Bonhwi Gu

A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a plurality of connection structures provided in a lower insulating layer of the edge region and arranged at first intervals in a first direction, an upper insulating layer covering the connection structures, and a plurality of redistribution pads disposed on the upper insulating layer and connected to the connection structures, respectively. Each of the redistribution pads includes a pad portion provided on the chip region. The pad portions of the redistribution pads are spaced apart from the connection structures by a first distance in a second direction intersecting the first direction when viewed in a plan view.

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Seoul, South Korea

Hyekyeong Kweon