Samsung Electronics Co., Ltd.

Hyejin Bang

Jeonga Kang

Sangil Park

Keemoon Lee

Hwanju Jeon

A cover member of an electronic device according to various embodiments of the present disclosure may comprise: a substrate film layer; a metal oxide layer disposed on the upper surface of the substrate film layer and formed by sputtering; a transparent member attached/disposed on the upper surface of the metal oxide layer; a primer layer disposed on the lower surface of the substrate film layer and made of a semi-transparent material; and a photocurable resin layer disposed on the lower surface of the primer layer, the photocurable resin layer comprising, on a surface thereof, a pattern structure in a designated stereoscopic shape. Other embodiments are also possible.

Cover member, electronic device comprising same, and cover member manufacturing method

Disclosed is an electronic device that includes a first plate that forms a first surface of the electronic device through which contents are output, a second plate that forms a second surface facing away from the first surface, and a side member that surrounds a space between the first plate and the second plate. The second plate includes a UV curable resin layer including a fine pattern that implements an interference effect and a prism effect of light and a metal nanoparticle layer printed on the fine pattern so as to have a specific orientation. Besides, it may be permissible to prepare various other embodiments speculated through the specification.

Growing community of inventors

Suwon-si, South Korea

Hyejin Bang