Kmw Inc

Hye Yeon Kim

Duk Yong Kim

Kyo Sung Ji

Chang Woo Yoo

Min Sik Park

Youn Jun Cho

Jae Hyun Park

Chi Back Ryu

Jin Soo Yeo

Jun Woo Yang

In Hwa Choi

Kyu Chul Choi

Jeong Hyun Choi

In Ho Kim

Min Seon Yun

Jae Ho Jang

A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.

Multiple-input multiple-output antenna apparatus and heat dissipation device therefor

An antenna device may include: a main housing configured to house and fix a first board having a plurality of heating elements mounted on a rear surface thereof; at least one U-shaped heat dissipation cluster detachably coupled to the rear surface of the main housing, and filled with a predetermined refrigerant, wherein the refrigerant receives heat from the heating elements and dissipates the heat to the outside while moving along a pattern flow path formed in a distributed manner toward the outside; and at least one heat-collection mediating fixing part configured to collect heat from the heating elements and transfer the collected heat to the U-shaped heat dissipation cluster, while mediating the attachment/detachment of the U-shaped heat dissipation cluster to/from the rear surface of the main housing.

Antenna device

The present invention relates to an antenna apparatus and, in particular, comprises: a main housing having an inner space formed therein so as to embed a main board and having a plurality of radiating fins provided on an outer surface thereof; a cover housing provided so as to shield the inner space of the main housing and having a plurality of radiating fins provided on an outer surface thereof; and a plurality of unit antenna blocks detachably coupled so as to occupy a portion of the outer surface of the cover housing, and having an antenna substrate embedded therein, the antenna substrate having one or more antenna elements and one or more antenna filters combined thereto, wherein the plurality of unit antenna blocks are signal-connected to the main board via at least one connecting card, thereby providing an advantage that dual banding can be realized as well as enabling effective heat dissipation.

Antenna apparatus

The present invention relates to a multi-input and multi-output antenna apparatus, and in particular, the antenna apparatus provides an advantage of easy heat dissipation and calibration control by comprising: an antenna unit in which a transmission and reception substrate and an antenna substrate having a plurality of electric elements provided on one surface or the other surface thereof are stacked and arranged in the front-rear direction; a control unit in which a BB substrate and a PSU substrate having a plurality of electric elements provided on one surface or the other surface thereof are stacked and arranged in the front-rear direction, and which is provided so as to enable calibration control by using a connection between the antenna unit and a power supply or a control signal; and at least one connecting card which is provided so as to enable connection of the power supply or the control signal between the antenna unit and the control unit.

Multi-input and multi-output antenna apparatus

The present disclosure relates to an MIMO antenna apparatus, and in particular, includes a PCB having at least one heat-generation element provided on one surface thereof, a first heat-dissipation part disposed to cover one surface of the PCB, having a through hole formed in a portion corresponding to the position provided with the heat-generation element, and having a plurality of vertical heat-dissipation fins formed to be extended in a direction perpendicular to the outside surface thereof, and a second heat-dissipation part detachably coupled to the through hole to contact one surface of the heat-generation element to receive heat from the heat-generation element and to dissipate heat at a long distance father than the first heat-dissipation part, thereby enhancing heat-dissipation performance and expanding universality of a product.

Multiple input multiple output antenna apparatus

Antenna

A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body. The heat transfer part has one end connected to the outer surface of the housing main body and another end connected to the additional cooling part to transfer heat generated from the plurality of electronic elements to the additional cooling part.

Cooling apparatus for electronic element

A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe. The unit heat pipe includes one end which is connected to the outer surface of the cooling cover and another end to which a plurality of cooling ribs are formed to extend outward in a radial direction from an outer circumferential surface of the another end of the unit heat pipe.

The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.

Growing community of inventors

Gangjin-gun, South Korea

Hye Yeon Kim