Samsung Electro-mechanics Co., Ltd.

Hye Yeon Cha

Hwan Soo Lee

Dong Hwan Lee

Sung Hyun Kim

Moon Soo Park

Jung Hyuk Jung

Woon Chul Choi

Tae Young Kim

Chan Young Yoon

Kang Heon Hur

Jung Min Park

Sung Hee Kim

Yong Sam Lee

Jae Hun Kim

Sang Moon Lee

Young Do Kweon

Jeong Bok Kwak

Hye Min Bang

Hwan-Soo Lee

Myoung Soon Park

Ji Hyun Eom

Sang Jae Lee

Eo Jin Choi

Youn Soo Seo

Jae Ha Kim

Ki Young Yoo

Jong Ho Lee

Sung Woo Kim

Hwi Dae Kim

Sung Jin Park

Young Sun Kim

Dong Jin Lee

Young Seuck Yoo

Sung Yong An

Taehoon Kim

Dong Jin Jeong

Jin Woo Han

Chang Sup Ryu

Tae Hyeok Kim

Jong Sik Yoon

Dong Min Kim

Yong Soo Oh

Jin Woo Hahn

Kwang Il Park

Young Soo Oh

Yongsoo Oh

Seong Min Chin

Ji Hye Oh

Jong Su Yi

Hyeog Soo Shin

Dong Sun Kim

Jong Seok Song

Ho Sik Park

Sam Jin Her

Kyung Han Ahn

A coil component includes a body having an upper surface and a lower surface opposing each other in a thickness direction, a support substrate disposed in the body and having one surface perpendicular to the lower surface of the body, a coil portion disposed on the support substrate, and first and second external electrodes disposed on the lower surface of the body. The body includes an active portion, covering the coil portion, and first and second cover portions, respectively disposed on opposing surfaces of the active portion. The active portion includes a first magnetic metal particle, a second magnetic metal particle having a smaller diameter than the first magnetic metal particle, and a first insulating resin. Each of the first and second cover portions includes a third magnetic metal particle, having a smaller diameter than the first magnetic metal particle, and a second insulating resin.

Coil component

A coil component includes a body having one surface and another surface opposing each other in one direction, a plurality of walls each connecting the one surface to the other surface, and a coil portion disposed therein. A recess extends along at least portions of edges common to the one surface and to walls of the plurality of walls. A lower insulating layer is disposed in the recess and on the one surface. First and second external electrodes penetrate through the lower insulating layer, are spaced apart from each other on the one surface of the body, and are connected to the coil portion. A shielding layer is disposed on the other surface of the body and the plurality of walls of the body, and extends to the one surface of the body to be spaced apart from the first and second external electrodes.

A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.

A coil component includes a body including a magnetic material; a support member disposed in the body; and a coil pattern on the support member in the body. The coil pattern may include a first conductor layer formed on the support member and having a planar spiral shape; a second conductor layer formed on the first conductor layer and having a volume of a lower portion greater than a volume of an upper portion; and a third conductor layer formed to cover the second conductor layer from the outside of the second conductor layer.

Coil component and method for manufacturing the same

A thin film type inductor includes a body and external electrodes disposed on an external surface of the body. The body includes a support member and an internal coil supported by the support member, the internal coil includes an upper coil disposed on one surface of the support member and a lower coil disposed on the other surface thereof, and the upper and lower coils are connected to each other by a via electrode. Heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction.

Thin film type inductor

There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.

Chip electronic component and manufacturing method thereof

A coil component includes a body including a magnetic material, a support member disposed inside the body, and a coil pattern disposed on the support member inside the body. The coil pattern includes a first conductive layer, having a planar spiral shape, and a second conductive layer, having a line width greater than a thickness thereof, while covering the first conductive layer. When viewed from a surface of the body cut in thickness and width directions, a line width of each of outermost and innermost patterns of the first conductive layer is different from a line width of at least one internal pattern disposed between the outermost and innermost patterns.

A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.

A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.

An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.

Inductor and manufacturing method thereof

A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.

Chip electronic component and board for mounting thereof

A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.

Method of manufacturing electronic component

Growing community of inventors

Suwon-si, South Korea

Hye Yeon Cha