Samsung Electronics Co., Ltd.

Jini Co., Ltd

Hye Sung Park

Jin Woo Bae

Bo Un Yoon

Il Young Yoon

Jong Hyuk Park

Bong Sik Choi

Hye Jin Jeong

Si Hyeon Lee

A method of manufacturing a semiconductor device includes forming a first pattern structure having a first opening and a second pattern structure having a second opening on a substrate, forming a gap fill layer in the second opening, forming fences and contact structures in the first opening, removing the gap fill layer in the second opening, forming an upper conductive layer to cover the first and second pattern structures, the fences, and the contact structures, forming a mask pattern based on a photolithography process using the second pattern structure covered by the upper conductive layer as an align mark, and etching the upper conductive layer using the mask pattern to form upper conductive patterns. A width of the second opening is larger than a width of a first opening. A thickness of the upper conductive layer is smaller than a depth of the second opening.

Methods of manufacturing semiconductor devices

Growing community of inventors

Hwaseong-si, South Korea

Hye Sung Park