Samsung Electro-mechanics Co., Ltd.

Hye Seong Kim

Jin Sung Kim

Eun Sang Na

Hee Jung Jung

Ok Nam Kim

Hyun Hee Gu

Jin Man Jung

Jeong Ryeol Kim

Hai Joon Lee

Byung Jun Jeon

Eun Hyuk Chae

Tae Hyeok Kim

Kyu Ha Lee

Seung Hee Yoo

Eun Joo Choi

Young Don Choi

Chang Joo Lee

There are provided a multilayer ceramic electronic component to be embedded in a board and a manufacturing method thereof, and particularly, a multilayer ceramic electronic component to be embedded in a board, in which a thickness of a ceramic body in an entire chip is increased by not allowing for an increase in a thickness of an external electrode while forming a band surface of the external electrode to have a predetermined length or greater for connecting the external electrode to an external wiring through a via hole, such that chip strength may be improved and the occurrence of damage such as breakage, or the like may be prevented, and a manufacturing method thereof, may be provided.

Multilayer ceramic electronic component to be embedded in board, manufacturing method thereof, and printed circuit board having multilayer ceramic electronic component embedded therein

A heat radiating member includes a body region having a first main surface and a second main surface opposing each other and lateral surfaces connecting the first main surface and the second main surface and having concave surfaces, and a curved surface region formed to have a convex surface on an edge at which at least one of the first main surface and the second main surface meets one of the lateral surfaces.

Heat radiating member and printed circuit board including same

An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.

Embedded device, and printed circuit board having the same

An embedded multilayer ceramic electronic component includes a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second internal electrodes, and first and second external electrodes, wherein the first external electrode includes a first base electrode electrically connected to the first internal electrode, a first intermediate layer, and a first terminal electrode, the second external electrode includes a second base electrode electrically connected to the second internal electrode, a second intermediate layer, and a second terminal electrode, the first and second base electrodes include a first conductive metal and glass, and the first and second terminal electrodes are formed of a second conductive metal.

Embedded multilayer ceramic electronic component and printed circuit board having the same

There is provided a multi-layered ceramic electronic component including a ceramic body including a dielectric layer, first and second internal electrodes disposed within the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, wherein the first and second external electrodes include a conductive metal and glass and further include a second phase material occupying an area of 1 to 80% with respect to an area of glass in the first and second external electrodes.

Multi-layered ceramic electronic component

Growing community of inventors

Gyunggi-do, South Korea

Hye Seong Kim