Samsung Electro-mechanics Co., Ltd.

Hye Min Bang

Jung Hyuk Jung

Myung Jun Park

Jang Yeol Lee

Hyun Hee Gu

Woon Chul Choi

Bum Su Kim

Jun Ah

Hee Sang Kang

Dong Hwan Lee

Tae Young Kim

Chan Young Yoon

Myung Sam Kang

Hye Yeon Cha

Bum Soo Kim

Ji Hye Oh

Woon Chui Choi

Jong Ho Lee

Tae Joon Park

Eun Jin Kim

Hai Joon Lee

Sung Min Cho

Ho Phil Jung

Duk Hyun Chun

A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 μm and a maximum thickness of the electrode layer is 5 to 20 μm.

Multilayer electronic component

A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes disposed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer disposed on a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first insulating coating layer disposed between the first and second electrode layers and having a discontinuous region, and a second insulating coating layer having a discontinuous region to cover at least a portion of a surface of the body. The second insulating coating layer is exposed from the external electrodes.

Multilayer capacitor

A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region, and a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure.

A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba&#x2014;Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.

Multilayer ceramic electronic component and board for mounting of the same

A multilayer capacitor includes a body including a stack structure in which dielectric layers are stacked and internal electrodes are stacked with one of the dielectric layers interposed therebetween and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode layer covering a first surface of the body to which the first internal electrode is exposed, a glass layer covering the first electrode layer and a second surface of the body connected to the first surface, and a second electrode layer covering the glass layer, and the glass layer includes an inner region having a discontinuous region and an outer region covering the second surface of the body and having an end exposed from the second electrode layer.

A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.

Multilayer seed pattern inductor and manufacturing method thereof

A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.

Multilayer seed pattern inductor, manufacturing method thereof, and board having the same

A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.

There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.

Chip electronic component and manufacturing method thereof

A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.

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Suwon-si, South Korea

Hye Min Bang