Samsung Sdi Co., Inc.

Hyundai Steel Company

Electronics and Telecommunications Research Institute

Samsung Electro-mechanics Co., Ltd.

Cheil Industries Inc.

Inha-industry Partnership Institute

Hye Jin Kim

Seong Ryong Nam

Mi Sun Kim

Ji Yeon Lee

Sung Min Ko

Mi Jeong Choi

Jin Ho Lee

Hyun Yeong Jung

Seung Pill Jung

Kyu Yeon Hwang

Jae Yeon Lee

Ho Sub Yoon

Ji Ho Kim

Chang Sup Ryu

Chang Hee Lee

Su Young Chi

Byung Gil Yoo

Je Youl Kong

Eung Soo Kim

Jea Hoon Lee

Gyu Seok Song

Jae Won Choi

Jae Hoon Kim

Going Sik Kim

Yeo Ju Cho

Seung Chae Yoon

Gi Hak Yim

Ji Young Kim

Jin Man Kim

Young Chul Park

Mi Jin Lee

Jeong Hwan Jang

Wan Yook

Disclosed is a method of manufacturing a blank for hot stamping, which includes forming a plated layer on a steel plate by immersing the steel plate in a plating bath including aluminum and silicon; and heating the steel plate on which the plated layer is formed at a first temperature for a first time period.

Blank for hot stamping, method for manufacturing the same, hot stamping component, and method for manufacturing the same

An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T≤t≤0.3T, where 'T' is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

Electronic component and board for mounting the same

Disclosed is a hot-stamping component, which includes a base steel plate; and a plated layer on the base steel plate and including a first layer, a second layer, and an intermetallic compound portion having an island shape in the second layer, wherein the first layer and the second layer are sequentially stacked, and an area fraction of the intermetallic compound portion with respect to the second layer is an amount of 20% to 60%.

Hot stamping component and method of manufacturing the same

A hot-stamped part according to an embodiment of the present invention comprises, as a base layer, a steel comprising: 0.28-0.38 wt % of carbon (C); 0.1-0.4 wt % of silicon (Si); 1.2-2.0 wt % of manganese (Mn); from greater than 0 to 0.020 wt % of phosphorus (P); from greater than 0 to 0.003 wt % of sulfur (S); 0.1-0.5 wt % of chromium (Cr); 0.0015-0.0040 wt % of boron (B); 0.025-0.05 wt % of titanium (Ti); and the remainder of iron (Fe) and inevitable impurities, wherein the microstructure of the base layer is full martensite.

Hot-stamped part and manufacturing method therefor

Disclosed is an organic light emitting display device including a substrate, an organic light emitting element formed on the substrate, and an encapsulation layer encapsulating the organic light emitting element, wherein the encapsulation layer has a structure in which at least two inorganic layers and at least one organic layer are alternately stacked one above another, each of the inorganic layers having a thickness of about 40 nm to about 1,000 nm and an index of refraction of about 1.41 to about 2.0, each of the organic layer having a thickness of about 0.2 &#x3bc;m to about 15 &#x3bc;m and an index of refraction of about 1.4 to about 1.65, the organic layer including a composition for encapsulating a display device, the composition for encapsulating a display device including a photocurable monomer and a photopolymerization initiator.

Organic light emitting display

Provided is an organic light emitting display comprising: a substrate including a light emitting zone and a non-light emitting zone, which is positioned around the outside of the light emitting zone; at least one organic light emitting diode formed on the light emitting zone; an encapsulation layer for sealing the organic light emitting diode; and a dam formed on the non-light emitting zone, wherein the encapsulation layer includes a structure in which at least one inorganic layer and at least one organic layer are alternatingly stacked, wherein the organic layer is made from a display sealing material composition, and wherein the display sealing material composition comprises a photo-curable monomer and a photopolymerization initiator. The photo-curable monomer comprises: a monomer not having an aromatic hydrocarbon group; and a monomer, represented by chemical formula 1, having at least two substituted or non-substituted phenyl groups, wherein the photo-curable monomer comprises approximately 5 wt. % to 45 wt. % of the monomer having the at least two substituted or non-substituted phenyl groups, and approximately 55 wt. % to 95 wt. % of a monomer not having the aromatic hydrocarbon group.

Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, two adjacent inorganic layers at least partially contact each other, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes a photocurable monomer and a photopolymerization initiator. The photocurable monomer includes a monomer containing no aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups represented by Formula 1. The photocurable monomer includes about 5 wt % to about 45 wt % of the monomer having two or more substituted or unsubstituted phenyl groups and about 55 wt % to about 95 wt % of the monomer containing no aromatic hydrocarbon group.

The present invention relates to a composition for a display sealing material having a photopolymerization initiator and a photocurable monomer, the photocurable monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups of chemical formula 1, wherein about 5 wt % to about 45 wt % of the monomer having two or more substituted or unsubstituted phenyl groups is comprised on the basis of the photocurable monomer and about 55 wt % to about 95 wt % of the monomer not having the aromatic hydrocarbon group is comprised on the basis of the photocurable monomer.

Composition for display sealing material, organic protection layer comprising same, and display device comprising same

A display sealing material composition includes a photopolymerization initiator and a photocuring monomer, the photocuring monomer comprising: a monomer not having the aromatic hydrocarbon group; and a monomer having two or more substituted or unsubstituted phenyl groups. An organic protection layer obtained by curing the composition for a display sealing material has approximately 400 nm/min or less plasma etching rate being represented by formula 1 below and approximately 2 nm or less surface roughness.Plasma etching rate(nm/min)=(0&#x2212;1)/&#x2003;&#x2003;&#x3c;Formula 1&#x3e;wherein T0, T1, and M are set forth in the specification.

Disclosed is a novel polyene-specific glycosyltransferase derived from. The glycosyltransferase includes an amino acid sequence of SEQ ID NO: 1 and a gene encoding the glycosyltransferase. The glycosyltransferase is produced by a method which includes the steps of: culturing transgenic recombinant microorganisms; and isolating glycosyltransferase from the cultured recombinant microorganisms.

[object Object]

Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, two adjacent inorganic layers at least partially contact each other, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate, about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate, about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate, and about 1 wt % to about 10 wt % of (D) an initiator, the (B) silicon-based di(meth)acrylate being represented by Formula 1.

Organic light emitting diode display apparatus

Disclosed is an organic light emitting diode display apparatus including: a substrate; an organic light emitting diode disposed on the substrate; and an encapsulation layer encapsulating the organic light emitting diode. The encapsulation layer has a structure in which two or more inorganic layers and one or more organic layers are alternately stacked one above another, each of the inorganic layers has a thickness of about 40 nm to about 1000 nm and an index of refraction of about 1.41 to about 2.0, each of the organic layers has a thickness of about 0.2 &#x3bc;m to about 15 &#x3bc;m and an index of refraction of about 1.4 to about 1.65, and the organic layers are formed of an encapsulating composition. The encapsulating composition includes: about 10 wt % to about 70 wt % of (A) a non-silicon-based di(meth)acrylate, about 20 wt % to about 70 wt % of (B) a silicon-based di(meth)acrylate, about 5 wt % to about 40 wt % of (C) a mono(meth)acrylate, and about 1 wt % to about 10 wt % of (D) an initiator, the (B) silicon-based di(meth)acrylate being represented by Formula 1.

An adhesive film includes an amine curing agent and a phenolic curing agent, and has a ratio of a storage modulus at 170&#xb0; C. after 80% or more curing to a storage modulus at 40&#xb0; C. before curing in the range of about 1.5 to about 3.0.

Adhesive film and electronic device including the same

The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.

Growing community of inventors

Suwon-si, South Korea

Hye Jin Kim