Samsung Electro-mechanics Co., Ltd.

Hye Ah Kim

Youn Kyu Choi

Yun Young Yang

Mi Jung Kang

Jae Yeol Choi

Do Won Kang

There is provided a chip electronic component including; a magnetic body containing magnetic metal powder; an internal coil part embedded in the magnetic body; and a plating spreading prevention part coated on a surface of the magnetic body. The plating spreading prevention part contains phosphate-based glass. Whereby, plating spread generated in the surface of the chip electronic component at the time of forming the external electrodes may be prevented.

Chip electronic component and manufacturing method thereof

A chip electronic component includes a magnetic body containing magnetic metal powder, internal coil parts embedded in the magnetic body, and an anti-plating layer disposed on at least one of upper and lower surfaces of the magnetic body. The anti-plating layer contains magnetic metal powder having particle sizes within the range of 0.1 &#x3bc;m to 10 &#x3bc;m.

Growing community of inventors

Suwon-si, South Korea

Hye Ah Kim