Samsung Electronics Co., Ltd.

Hwi-jong Yoo

Young-rok Oh

Heeyoub Kang

Kitaek Lee

Ilsoo Kim

Su-jin Kim

Sun-ki Yun

Byung-guk Seo

Young-Min Kim

Joo-Young Kim

Yusuf Cinar

Kwang-Kyu Bang

Iksung Park

Il-Soo Kim

Ki-Taek Lee

Eun-Ji Yu

Eunji You

Min-Young Choi

A memory system includes a printed circuit board, at least one memory chip mounted on the printed circuit board, and a memory controller arranged on the printed circuit board and connected to 2(where N is an integer of 2 or more) channels, the memory controller configured to perform a write operation and a read operation on the at least one memory chip. In the printed circuit board, a first subset of the channels corresponds to a first channel group configured in a point to point topology, and a remaining subset of the channels corresponds to a second channel group configured in a daisy chain topology.

Memory system and storage device including printed circuit board with subset of channels arranged in point-to-point topology and subset of channels arranged in daisy-chain topology

A semiconductor module includes a substrate, a first package mounted on the substrate, second packages mounted on the substrate, a label layer provided on the substrate, and a heat transfer structure interposed between the substrate and the label layer and overlapping at least two of the second packages in a plan view of the module.

Semiconductor module

Memory system and storage device including printed circuit board where channel groups have both point to point topology and daisy chain topology

Heart transfer label structure

Semiconductor module including package and heat transfer structure

Disclosed is a printed circuit hoard. The printed circuit board includes a plurality of insulation layers and a plurality of pattern layers alternately stacked. The printed circuit board includes a plurality of device areas on which semiconductor packages are mounted and a peripheral area adjacent the device areas. An electrostatic discharge pattern is in a respective pattern layer among the plurality of pattern layers and is disposed at a boundary region between a respective device area of the plurality of device areas and the peripheral area.

Printed circuit board

A semiconductor storage device includes a circuit substrate. The circuit substrate includes a main body and a connection tab connected to a side of the main body. The a main body includes a first chip mounting region and a second chip mounting region. A first semiconductor chip of a first type is mounted on the first chip mounting region. A second semiconductor chip of a second type is mounted on the second chip mounting region. The first type of the first semiconductor chip is different from the second type of the second semiconductor chip. The circuit substrate further includes a first thermal via in the connection tab and comprising a conductive material.

Semiconductor storage devices

A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.

Memory module and solid state drive having the same

Growing community of inventors

Seoul, South Korea

Hwi-jong Yoo