United Microelectronics Corp.

Ipenval Consultant Inc.

Powerchip Semiconductor Manufacturing Corporation

United Semiconductor Corp.

Hwi-Huang Chen

Gary Y Hong

Ming-Sheng Yang

Yueh-Feng Ho

Chao-Yuan Huang

Jih-Wen Chou

Chih-Hung Lin

Yu-Jen Huang

Hsin-Hong Chen

Jih-Wei Liou

Chen-Chiu Hsue

Ming-Tsung Tung

Joe Ko

Anchor Chen

Chih-Jen Huang

Yau-Kae Sheu

Robin Lee

Jung-Ching Chen

Ming-Tsung Lee

Chia-Hao Chang

Wenchi Ting

Chin-Hung Liu

Chien-Ming Lin

Po-Hsien Yeh

Chih-Hung Lu

Robin Christine Hwang

Yen-Chang Chen

Pao-Chuan Lin

Yun-Han Ma

Shih-Ming Liang

Wen-Chi Ting

The disclosure provides a semiconductor structure and a method of forming the same. The semiconductor structure includes a base pattern including a channel region and a drain region, a first semiconductor layer on the channel region of the base pattern, and a gate structure on the first semiconductor layer. The gate structure includes a first stack disposed on the first semiconductor layer and a second stack disposed on the first stack. The first stack includes a first sidewall adjacent to the drain region and a second sidewall opposite to the first sidewall in a first direction parallel to a top surface of the base pattern. The first sidewall is at a first distance from the second stack in the first direction, and the second sidewall is at a second distance from the second stack in the first direction. The first distance is greater than the second distance.

Semiconductor structure and method of forming the same

A GaN device with Npre-treatment is provided in the present invention, including a GaN substrate, an AlGaN layer covering the GaN substrate, a p-GaN gate on the AlGaN layer, a TiN electrode on the p-GaN gate, a first dielectric layer on the AlGaN layer surrounding the p-GaN gate, wherein a horizontal spacing is between the first dielectric layer and the p-GaN gate, and an interface between the AlGaN layer and the GaN substrate not covered by the first dielectric layer is subject to Npre-treatment, and a second dielectric layer covering on and directly contacting the exposed first dielectric layer, AlGaN layer, p-GaN gate and TiN electrode.

GaN device with N2 pre-treatment and method of performing Npre-treatment

A HEMT device including a substrate structure, a channel layer, a barrier layer, a gate electrode, a drain electrode, a first source field plate, a second source field plate, and a dielectric structure is provided. The first source field plate extends from the second side of the gate electrode to the first side of the gate electrode. The second source field plate is located on the first side of the gate electrode and is located between the drain electrode and the first source field plate. There is a gap between the first source field plate and the second source field plate. The first source field plate has an end adjacent to the gap. The thickness of the dielectric structure located directly below the second source field plate is greater than the thickness of the dielectric structure located directly below the end of the first source field plate.

High electron mobility transistor device and manufacturing method thereof

An integrated circuit layout comprises a through silicon via (TSV) configured to couple positive operational voltage VDD (VDD TSV), a through silicon via (TSV) configured to couple operational signals (signal TSV), a plurality of through silicon vias (TSVs) configured to couple operational voltage VSS (VSS TSVs) around the VDD TSV and the signal TSV and one or more backside redistribution lines (RDLs) connecting the VSS TSVs together to form a web-like heat dissipating structure at least surrounding the VDD TSV and the signal TSV.

Integrated circuit layout

A semiconductor device comprises a substrate, a through-silicon via (TSV) penetrating the substrate, a plurality of first interconnect structures, right above the TSV, configured for electrically coupling the TSV to a higher-level interconnect, a second interconnect structure traversing the TSV from the top and being configured for interconnect routing of an active device and a plurality of dummy metal patterns, right above the TSV, electrically isolated from the TSV, the first interconnect structures and the second interconnect structure.

Semiconductor device

A stacked chip system is provided to comprise a first chip, a second chip, a first group of through silicon vias (TSVs) connecting the first chip and second chip and comprising at least one first VSS TSV, at least one first VDD TSV, a plurality of first signal TSVs and at least one first redundant TSV and a second group of through silicon vias (TSVs) connecting the first chip and second chip and comprising at least one second VSS TSV, at least one second VDD TSV, a plurality of second signal TSVs and at least one second redundant TSV, wherein all the first group of TSVs are coupled by a first selection circuitry configured to select the at least one first redundant TSV and bypass at least one of the rest of the first group of TSVs, and wherein the at least one first redundant TSV and the at least second redundant TSV are coupled by a second selection circuitry configured to allow one of them to replace the other.

Stacked chip system

A method for fabricating a through-silicon via comprises the following steps. Provide a substrate. Form a through silicon hole in the substrate having a diameter of at least 1 &#x3bc;m and a depth of at least 5 &#x3bc;m. Perform a first chemical vapor deposition process with a first etching/deposition ratio to form a dielectric layer lining the bottom and sidewall of the through silicon hole and the top surface of the substrate. Perform a shape redressing treatment with a second etching/deposition ratio to change the profile of the dielectric layer. Repeat the first chemical vapor deposition process and the shape redressing treatment at least once until the thickness of the dielectric layer reaches to a predetermined value.

Method for fabricating a through-silicon via

A high voltage device is provided. The high voltage device includes a gate on a substrate, two source/drain regions in the substrate beside the gate, and a composite gate dielectric layer that includes at least two stacked continuous layers, extending from one side to another side of the gate. Wherein, the at least two stacked continuous layers is a combination of at least one thermal oxide layer and at least one chemical vapor deposited layer.

Method of fabricating high voltage device

A high voltage MOS transistor including a substrate, a well, a gate insulation layer, a gate, two drift regions, a channel region, a source/drain region and an isolation structure is provided. The well is disposed in the substrate and the gate insulation layer is disposed over the substrate. The gate is disposed over the gate insulation layer. The two drift regions are in the well at two sides of the gate and the width of the gate is smaller than or equal to that of the drift regions. The channel region is disposed between the drift regions and the width of the channel region is greater than that of the drift regions. The source/drain regions are formed within the drift regions. The isolation structure is disposed inside the drift regions between the source/drain region and the channel region. The drift regions enclose the source/drain regions and the isolation structure.

High voltage metal oxide semiconductor transistor and fabricating method thereof

A high-voltage device structure includes a high-voltage device disposed on a semiconductor substrate. The semiconductor includes an active region and an isolation region, and the high-voltage device is disposed in the active region. The high-voltage device structure includes a source diffusion region of a first conductive type, a drain region of the first conductive type, and a gate longer than the source diffusion region and the drain diffusion region so as to form spare regions on both sides of the gate. The isolation region is outside the active region and surrounds the active region. In the isolation region, an isolation ion implantation region of a second conductive type and an extended ion implantation region are disposed to prevent parasitic current from being generating between the source diffusion region and the drain diffusion region.

High-voltage device structure

A method for operating a non-volatile memory device, which is applicable to an n-channel non-volatile memory device, wherein a positive voltage is applied to the control gate, a negative voltage is applied to the drain region while the source region is floating. Furthermore, a negative voltage is applied to the substrate to program to the n-channel memory device by the channel Fowler-Nordheim tunneling effect. To erase the n-channel non-volatile memory device, a negative voltage is applied to the control gate, a positive voltage is applied to the drain region, and the source region is floating. Moreover, a positive voltage is applied to the substrate to erase the n-channel memory device using the channel Fowler-Nordheim tunneling effect.

Method for operating a non-volatile memory

A fabrication method and a structure of a flash memory. Several first shallow trench isolations and second shallow trench isolations are formed in a memory circuit region and a peripheral circuit region of a substrate, respectively. The first shallow trench isolations are shallower than the second shallow trench isolations. Several gates are formed along a direction perpendicular to the substrate in the memory circuit region. A self-aligned source region process is performed to remove the isolation layer within every other first shallow trench isolations between the gates. A common source region and a column of separate drain regions are thus alternatively formed between the gates. The drain regions in the same column are isolated by the first shallow trench isolations.

Fabrication method and structure of a flash memory

In present invention we provide a vertical two-transistor memory cell consisted of a MOS transistor and an ETOX cell. One of the drain or source of the MOS transistor is connected to the control gate of the ETOX cell, the other is acted as the control gate of the vertical two-transistor memory cell and is connected to a control line. And the gate of the MOS transistor is acted as the select gate of the vertical two-transistor memory cell and is connected to a word line. The drain of ETOX cell is connected to a bit line, and the source of ETOX cell is grounded. The vertical two-transistor memory cell can be programmed by channel Fowler-Nordheim tunneling of electrons which is injected from the substrate through the channel and tunnel oxide into the floating gate. Such memory cell can avoid the word line disturb by controlling the word line. The memory cell can be also erased by channel Fowler-Nordheim tunneling, in which the electrons is withdrawn from the floating gate through the tunnel oxide and channel to the substrate. In addition, the vertical two-transistor memory cell can be also programmed by conventional methods such as hot electron injection and drain Fowler-Nordheim tunneling, and can be also erased by negative gate source erase or drain Fowler-Nordheim tunneling erase.

Vertical two-transistor flash memory

A method of forming a flash memory device is described. A substrate at least comprises a memory region and a peripheral circuit region. A stacked gate is formed on the memory region. The stacked gate comprises a tunneling oxide layer, a floating gate and a control gate. A capacitor is formed on the peripheral circuit region. A dielectric layer is formed over the substrate to cover the peripheral circuit region. A thin spacer is formed on the sidewall of the stacked gate. A doped region is formed in the memory region by ion implantation. A thermal process is performed to drive the dopant in the doped region into the substrate and to oxidize a part of the floating gate above the edge of the tunneling oxide layer.

Method of forming a flash memory device

A method for forming a self-aligned silicide (or called salicide) structure in IC fabrication is described. This method is characterized by the step of making the top surface of a polysilicon-based structure into a rugged surface, which allows the subsequently formed salicide structure over the rugged surface of the polysilicon-based structure to have an increased surface area and thus have a reduced sheet resistance when compared to the prior art. By this method, the first step is to prepare a semiconductor substrate, after which an oxide layer is formed over the substrate. Next, a polysilicon-based structure is formed over the oxide layer, and then the exposed surface of the polysilicon-based structure is reshaped into a rugged surface. Subsequently, a silicide layer is formed over the rugged surface of the polysilicon-based structure, which serves as the intended salicide structure.

Growing community of inventors

Hsinchu, Taiwan

Hwi-Huang Chen