Samsung Electronics Co., Ltd.

Sungkyunkwan University

Korea Advanced Institute of Science and Technology

Hwansoo Suh

Insu Jeon

Qinke Wu

Jineun Kim

Jhinhwan Lee

Young-jae Song

Seong-jun Jung

Minwoo Kim

Yeonsang Park

Chang-won Lee

Youngtek Oh

Hyeokshin Kwon

Sung-kyu Jang

Sangwoo Park

Yeon-sang Park

Youngjae Song

Sungjoo Lee

Sung-joo Lee

Min Wang

Min-woo Kim

Chang Won Lee

Yeongtek Oh

An amplifier circuit and a method of recovering an input signal in the amplifier circuit are provided. The amplifier circuit may recover an input signal by using a time constant and an output signal of a signal amplifier which is delayed by a certain period, based on characteristics of an inverse Laplace transform of a transfer function of the signal amplifier. A time required for recovering the input signal may be shorter than the time constant of the signal amplifier.

Amplifier circuit and method of recovering input signal in the amplifier circuit

A piezoelectric actuator and a method of measuring a motion by using the piezoelectric actuator are provided. The piezoelectric actuator includes: a movable member that is disposed to face the fixed member; a piezoelectric element that is disposed between the fixed member and the movable member, and configured to operate in a shear mode based on input voltages applied to the piezoelectric element and move the movable member relative to the fixed member; and a position sensor that is disposed between the piezoelectric element and the movable member, and configured to measure a motion of the movable member.

Piezoelectric actuator and method of measuring motion by using the same

A seamless hexagonal h-BN atomic monolayer thin film has a pseudo-single crystal structure including a plurality of h-BN grains that are seamlessly merged. Each of the h-BN grains has a dimension in a range from about 10 &#x3bc;m to about 1,000 &#x3bc;m. The seamless hexagonal boron nitride (h-BN) atomic monolayer thin film may be fabricated by a process including pre-annealing a metal thin film at a first temperature in a chamber while supplying hydrogen gas to the chamber; supplying nitrogen source gas and boron source gas to the chamber; and forming the seamless h-BN atomic monolayer thin film having a pseudo-single crystal atomic monolayer structure having a grain dimension in a range from about 10 &#x3bc;m to about 1,000 &#x3bc;m by annealing the pre-annealed metal thin film at a second temperature.

Seamless hexagonal boron nitride atomic monolayer thin film and method of fabricating the same

Provided are methods of forming nanostructures, methods of manufacturing semiconductor devices using the same, and semiconductor devices including nanostructures. A method of forming a nanostructure may include forming an insulating layer and forming a nanostructure on the insulating layer. The insulating layer may have a crystal structure. The insulating layer may include an insulating two-dimensional (2D) material. The insulating 2D material may include a hexagonal boron nitride (h-BN). The insulating layer may be formed on a catalyst metal layer. The nanostructure may include at least one of silicon (Si), germanium (Ge), and SiGe. The nanostructure may include at least one nanowire.

Method of forming nanostructure, method of manufacturing semiconductor device using the same, and semiconductor device including nanostructure

Provided are a magnetic resistance structure, a method of manufacturing the magnetic resistance structure, and an electronic device including the magnetic resistance structure. The method of manufacturing the magnetic resistance structure includes forming a hexagonal boron nitride layer, forming a graphene layer on the boron nitride layer, forming a first magnetic material layer between the boron nitride layer and the graphene layer according to an intercalation process; and forming a second magnetic material layer on the graphene layer.

Magnetic resistance structure, method of manufacturing the magnetic resistance structure, and electronic device including the magnetic resistance structure

According to example embodiments, a method of forming a multilayer graphene structure includes forming a sacrificial layer on the growth substrate, growing a first graphene layer on the sacrificial layer using a chemical vapor deposition (CVD) method, and growing at least one more graphene layer on the growth substrate. The growing at least one more graphene layer includes removing at least a part of the sacrificial layer.

Method of forming multilayer graphene structure

A surface plasmon polariton modulator capable of locally varying a physical property of a dielectric material to control a surface plasmon polariton. The surface plasmon polariton modulator includes a dielectric layer, including first and second dielectric portions, which is interposed between two metal layers. The second dielectric portion has a refractive index which varies with an electric field, a magnetic field, heat, a sound wave, or a chemical and/or biological operation applied thereto. The surface plasmon polariton modulator is configured to control one of an advancing direction, an intensity, a phase, or the like of a surface plasmon using an electric signal. The surface plasmon polariton modulator can operate as a surface plasmon polariton multiplexer or a surface plasmon polariton demultiplexer.

Surface plasmon polariton modulator

Growing community of inventors

Gunpo-si, South Korea

Hwansoo Suh