Henkel IP Holding Gmbh

Henkel Corporation

Hwang Kyu Yun

YounSang Kim

Raj Peddi

Jeffrey Leon

Qing Ji

Chew Beng Chan

Weitong Shi

Renzhe Zhao

A method for preparing a semiconductor wafer into individual semiconductor dies uses both a dicing before grinding step and/or via hole micro-fabrication step, and an adhesive coating step.

Coating adhesives onto dicing before grinding and micro-fabricated wafers

This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages ('CSPs'), ball grid arrays ('BGAs'), land grid arrays (&#x201c;LGAs&#x201d;) and the like, each of which having a semiconductor chip, such as large scale integration (&#x201c;LSI&#x201d;), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (&#x201c;snap cure underfills&#x201d;), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55&#xb0; C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport. The inventive compositions possess an exotherm under 300 J/g and/or demonstrate package stability at 55&#xb0; C. for 7 days and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

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Irvine, CA, United States of America

Hwang Kyu Yun