Samsung Electronics Co., Ltd.

Hwang-Bok Ryu

Ho-Geon Song

Jae-Yong Park

Jae Yong Park

Whasu Sin

Ky-Hyun Jung

Goon Woo Kim

An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.

Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck portion on the preliminary compressed ball using the preliminary compressed ball and the wire. The capillary may be moved obliquely and downwardly to form a compressed ball. The capillary may extend the wire from the compressed ball to a second pad.

Method of forming at least one bonding structure

Growing community of inventors

Asan-si, South Korea

Hwang-Bok Ryu