Samsung Electro-Mechanics Co., Ltd.

Snu Rdb Foundation

Hwa Young Lee

Geum Hee Yun

Yong Jong Park

Tae Kyoung Kim

Ha Yong Jung

Jin Cheol Kim

Jun Rok Oh

Jeong Wook Seo

Jae Choon Cho

Su Yeon Lee

Kwan Yeol Paek

Sang Jun Yoon

Ho Lim

Soo Young Yoon

Do Yeung Yoon

Ji Young Chang

A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.

Capacitor component

A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein the encapsulant is a cured photosensitive resin composition including a thermosetting resin, a carboxylic resin, an ethylenically unsaturated compound, and a reinforcing agent. The photosensitive resin composition may be used in the fan-out semiconductor package.

Fan-out semiconductor package and photosensitive resin composition

Disclosed herein is a curable cyclic phosphazene compound having a low dielectric constant, a low dielectric loss index and high thermal stability, and a method of preparing the same. The curable cyclic phosphozene polymer prepared using the compound has a low dielectric constant and excellent thermal properties, compared to conventional phosphozene polymers.

Curable cyclic phosphazene compound and method of preparing the same

Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from &#x2212;300 to +300 ppm/&#xb0; C. in the temperature range of &#x2212;55&#x2dc;125&#xb0; C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.

Insulating material for printed circuit board

Growing community of inventors

Gyunggi-do, South Korea

Hwa Young Lee