Samsung Electro-mechanics Co., Ltd.

Korea Institute of Science and Technology

Hwa Sun Park

Seok Pil Lee

Doo Hwan Lee

Deok Ha Woo

Young Tae Byun

Chang Sup Ryu

Han Seo Cho

Jong Chang Yi

Tae Eui Kim

Seung Gu Kim

A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.

Method of manufacturing printed circuit board having embedded resistors

Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S), step for forming mounting holes in the insulating member (S), step for mounting the electronic component on the insulating member to meet the position-setting means and the mounting holes (S), step for forming copper cladding coated with an adhesive on the insulating member (S), step for applying heat and/or pressure to the copper cladding (S), and step for forming a via-hole in the copper cladding to be electrically connected to the electronic component, and step for forming a circuit pattern in the copper cladding (S). The step (S) can comprise a step (S) for applying inter-adhesive on respective surfaces of the insulating member, and a step (S) for applying copper cladding on respective surfaces of the inter-adhesive.

Method for manufacturing circuit board with built-in electronic components

A fabrication method of an epilayer structure for InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency. It relates to a P-p-n-N InGaAsP/InP ridge waveguide phase modulator fabricated to be that the phase change of the TE-mode is linearly proportional to the reverse bias voltage at 1.55 &#x3bc;m wavelength. A method for fabricating an epilayer structure for achieving the optical confinement in the vertical direction of an InGaAsP/InP waveguide phase modulator, characterized by comprising the steps of: forming a first cladding layer of N-InP on an N-InP substrate; forming a first waveguide layer of n-InGaAsP and a second waveguide layer of p-InGaAsP in sequence on the first cladding layer; forming a second cladding layer of P-InP and a third cladding layer of P-InP in sequence on the second waveguide layer; and forming an electrode layer of pInGaAs on the third cladding layer.

Fabrication method of an epilayer structure InGaAsP/InP ridge waveguide phase modulator with high phase modulation efficiency

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Seoul, South Korea

Hwa Sun Park