Hrl Laboratories, LLC

Hwa Chang Seo

Jeong-sun Moon

Kyung-Ah Son

Ryan G Quarfoth

Richard Michael Kremer

Jack A Crowell

Mariano J Taboada

Joshua M Doria

Kangmu Lee

Baohua Yang

Danny Wong

Terry B Welch

Hasan Sharifi

Pamela R Patterson

Wah S Wong

A device having: a multilayer composite phase change material structure with: a bottom PCM layer of a first SbTe PCM material having a first metallic doping; a first composite PCM layer on the bottom PCM layer, wherein the first composite PCM layer comprises at least: a first composite layer, comprising said first PCM material having a second metallic doping; and a second composite layer, comprising said first SbTe PCM material undoped, on the first composite layer; and a top PCM layer, comprising first SbTe PCM material having said first metallic doping, on the composite PCM layer. The first metallic doping can be identical to the second metallic doping. The first PCM material can comprise SbTe and the first and second metallic dopings can comprise one of Ge, In and GeIn.

Reconfigurable devices with multi-layer composite phase change materials

A high-resistivity N-doped ruthenium oxide thin film is formed on a substrate by flowing argon and nitrogen gases in a sputter chamber that includes a preconditioned ruthenium oxide sputter target. The method includes forming a plasma and sputter depositing a high-resistivity N-doped ruthenium oxide thin film with a N/Ru atomic ratio between 0.5 and 3.0 and resistivity greater than 0.01 Ω cm on the substrate in the substrate. A high-resistivity H-doped ruthenium oxide thin film is formed on a substrate by first forming an oxygen-rich ruthenium oxide thin film, followed by a hydrogen anneal. A temperature sensor structure includes a high-resistivity ruthenium oxide thin film that is doped with nitrogen or hydrogen and has a resistivity between 0.01 and 1 Ω cm.

High-resistivity ruthenium oxide thin film fabrication and temperature sensor structure with high-resistivity ruthenium oxide thin film

A process enables growing thick stoichiometric crystalline and preferably IR-transparent optical PCMO material on Si and other substrates. Sputter deposition is carried out in oxygen-free inert gas (e.g., Ar) environment, which helps to prevent decomposition of the PCMO material over the substrate. In the disclosed process, there is no need to add a seed layer prior to PCMO deposition. Moreover, no post-deposition annealing is needed in a high-temperature and high-pressure oxygen furnace, but an anneal provides certain additional benefits in terms of improved transparency at IR wavelengths. Over a long deposition time for a thick PCMO film on the high temperature (≥450° C.) substrates, the PCMO deposition is made repeated cycles of deposition of the PCMO material at the high temperature, each deposition cycle being followed by cooling the PCMO-deposited substrate to a substantially lower temperature (<50° C.). If an anneal is applied in a hydrogen environment that will cause hydrogenation of the PCMO film which yields PCMO films with an extremely small optical loss (i.e., optical extinction coefficient k<0.001) over the entire IR range.

Method for growing crystalline optical films on Si substrates which may optionally have an extremely small optical loss in the infra-red spectrum with hydrogenation of the crystalline optical films

An electric field-controlled refractive index tunable device includes a phase change correlated transition metal oxide layer, and E-field responsive charge dopants. The E-field responsive charge dopants either accumulate in the phase change correlated transition metal oxide layer or are depleted from the phase change correlated transition metal oxide layer in response to an E-field applied to the phase change correlated transition metal oxide layer.

Electric field-tunable IR devices with very large modulation of refractive index and methods to fabricate them

A method of providing a spatial light modulator comprising: providing a substrate; providing a first phase change material cell on the substrate, the first phase change material cell comprising: a first electrical heater on the substrate; a first optical reflector layer on the electrical heater; and a first phase change material layer on the optical reflector layer; and providing at least a second phase change material cell on the substrate, the second phase change material cell comprising: a second electrical heater on the substrate; a second optical reflector layer on the second electrical heater; a second phase change material layer on the second optical reflector layer; and providing a light absorber layer between the first phase change material cell and the second phase change material cell.

Spatial light modulator using phase-change materials with improved fill factor

A process enables growing thick stoichiometric crystalline and preferably IR-transparent optical PCMO material on Si and other substrates. Sputter deposition is carried out in oxygen-free inert gas (e.g., Ar) environment, which helps to prevent decomposition of the PCMO material over the substrate. In the disclosed process, there is no need to add a seed layer prior to PCMO deposition. Moreover, no post-deposition annealing is needed in a high-temperature and high-pressure oxygen furnace, but an anneal provides certain additional benefits in terms of improved transparency at IR wavelengths. Over a long deposition time for a thick PCMO film on the high temperature (&#x2265;450&#xb0; C.) substrates, the PCMO deposition is made repeated cycles of deposition of the PCMO material at the high temperature, each deposition cycle being followed by cooling the PCMO-deposited substrate to a substantially lower temperature (&#x3c;50&#xb0; C.). If an anneal is applied in a hydrogen environment that will cause hydrogenation of the PCMO film which yields PCMO films with an extremely small optical loss (i.e., optical extinction coefficient k&#x3c;0.001) over the entire IR range.

A field effect transistor includes a substrate, a passivation layer on the substrate forming a passivated substrate, wherein the passivation layer is inert to XeF, and a graphene lateral heterostructure field effect transistor (LHFET) on the passivated substrate.

Graphene LHFETS (lateral heterostructure field effect transistors) on SI compatible with CMOS BEOL process

A Field Effect Transistor (FET) device and a method for manufacturing it are disclosed. The FET device contains a graphene layer, a composite gate dielectric layer disposed above the graphene layer, wherein the composite gate layer is passivated with fluorine, and a metal gate disposed above the composite gate dielectric layer. The method disclosed teaches how to manufacture the FET device.

Metal oxide semiconductor field effect transistor and method of manufacturing same

A spatial light modulator includes a substrate, a phase change material cell on the substrate, the phase change material cell including an electrical heater on the substrate, an optical reflector layer on the electrical heater, and a phase change material layer on the optical reflector layer.

Spatial light modulator using phase-change matertals with improved fill factor

A device including a biopolymer membrane, a passivation layer on the biopolymer membrane, a graphene layer on the passivation layer, a source electrode on the graphene layer, and a drain electrode on the graphene layer, wherein the graphene layer extends between the source electrode and the drain electrode.

Graphene transistors on microbial cellulose

A photodetector comprising a region of a p-type phase-change chalcogenide material forming a heterojunction with a region of n-type Silicon; wherein the p-type phase-change chalcogenide material comprises one of GeTe and SbTe.

P-Type chalcogenide and n-type silicon heterojunction infared photodiodes and method of manufacturing thereof

P-type chalcogenide and N-type silicon heterojunction infrared photodiodes and method of manufacturing thereof

An optical device includes an optically transparent and electrically conducting conductor including graphene, a network of metal nanowires, or graphene integrated with a network of metal nanowires. The optical device includes a II VI compound semiconductor, a III V compound semiconductor, or InAsSb.

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Torrance, CA, United States of America

Hwa Chang Seo