Altera Corporation

Adaptive Digital Power, Inc.

Intel Corporation

Tc1 LLC

Other

Huy X Ngo

Keith Duwel

David Wolk Mendel

Curt Wortman

Chong H Lee

Vinson Chan

Jeffrey Erik Schulz

Jakob Raymond Jones

Carine Hoarau

Divya Vijayaraghavan

John Nguyen

Fabian Franco

Donald Wile

Herman Henry Schmit

Haiyun Yang

A seemingly monolithic interface between separate integrated circuit die may appear to be parallel or asynchronous from the perspective of the separate integrated circuit die. The signals of the seemingly monolithic interface, however, may actually be communicated between the separate die via serial and/or synchronous communication. In one method, a number of signals stored in a first parallel interface on a first integrated circuit die may be sampled. In some cases, at least one of the signals may be sampled more often than another one of the signals. A serial signal may be generated based on sampled signals. The serial signal may be transmitted to a corresponding second parallel interface on the second integrated circuit die.

Seemingly monolithic interface between separate integrated circuit die

Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

Multichip package with protocol-configurable data paths

Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1&#xd7; mode or 2&#xd7; mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

At least some embodiments of the disclosure may advantageously limit bleeding and the occurrence of blood leaks after heart pump implantation. In some embodiments, a base may be provided that includes a flexible layer mechanically coupled with a conduit. The flexible layer may be coupled with the proximal end of the conduit. The conduit may be configured to receive a cannula of the heart pump therethrough. The outer surface of the conduit may be configured to engage a surface of the heart formed after coring the heart. The conduit may be metal and may have a flared and/or beveled distal end. The conduit may be a flexible material. A distal flexible layer may be provided at a distal end of the conduit that is configured to engage with an inner surface of the heart.

Heart pump cuff

Systems and methods are disclosed for buffering data using a multi-function, multi-protocol first-in-first-out (FIFO) circuit. For example, a data buffering apparatus is provided that includes a mode selection input and a FIFO circuit that is operative to buffer a data signal between a FIFO circuit input and a FIFO circuit output, wherein the FIFO circuit is configured in an operating mode responsive to the mode selection signal.

Multi-function, multi-protocol FIFO for high-speed communication

Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1x mode or 2x mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

Various structures and methods are disclosed related to configurable scrambling circuitry. Embodiments can be configured to support one of a plurality of protocols. Some embodiments relate to a configurable multilane scrambler that can be adapted either to combine scrambling circuits across a plurality of lanes or to provide independent lane-based scramblers. Some embodiments are configurable to select a scrambler type. Some embodiments are configurable to adapt to one of a plurality of protocol-specific scrambling polynomials. Some embodiments relate to selecting between least significant bit ('LSB') and most significant bit ('MSB') ordering of data. In some embodiments, scrambler circuits in each lane are adapted to handle data that is more than one bit wide.

Configurable multi-lane scrambler for flexible protocol support

Systems and methods and systems are disclosed for allowing the medium access control (MAC) layer in a communication system within an integrated circuit or device to accurately determine a timestamp point and a timestamp value when, for example, the Precision Time Protocol (PTP) protocol is in use by the communication system. Such determination of accurate timestamp point and timestamp value may be used by the communication system to account for and to compensate for the time shift(s) from forward error correction (FEC) sublayer changes in a data frame that is transmitted by the MAC layer. Feedback is provided to the MAC from the FEC to allow the MAC to accurately determine the timestamp point and timestamp value align preamble of the data frame to the beginning of the FEC bit block that is output by the FEC sublayer.

Growing community of inventors

Fremont, CA, United States of America

Huy X Ngo