Nxp Usa, Inc.

Freescale Semiconductor,inc.

Hussain Hasanali Ladhani

Jeffrey Kevin Jones

Gerard J Bouisse

Lakshminarayan Viswanathan

Enver Krvavac

Mahesh K Shah

Joseph Staudinger

Li Li

Fernando A Santos

Audel Sanchez

Ibrahim Khalil

Joseph Gerard Schultz

Yu-Ting David Wu

Jerry Lynn White

Maruf Ahmed

Damon G Holmes

Elie A Maalouf

Michael E Watts

Humayun Kabir

Lu Li

Jeffrey Alois Frei

Henry Andre Christange

Shishir Ramasare Shukla

A power splitter for use in an amplifier (e.g., a Doherty amplifier) includes an input terminal, and first and second output terminals. The input terminal is configured to receive an input RF signal, the first output terminal is configured to produce a first RF output signal, and the second output terminal is configured to produce a second RF output signal. The power splitter also includes a first capacitance electrically coupled between the input terminal and the first output terminal, a second capacitance electrically coupled between the input terminal and the second output terminal, a first inductance electrically coupled between the input terminal and a ground reference node, a second inductance electrically coupled between the first output terminal and the ground reference node, a third inductance electrically coupled between the second output terminal and the ground reference node, and a resistance electrically coupled between the first and second output terminals.

Wideband RF power splitters and amplifiers including wideband RF power splitters

A radio frequency (RF) power transistor circuit includes a power transistor and a decoupling circuit. The power transistor has a control electrode coupled to an input terminal for receiving an RF input signal, a first current electrode for providing an RF output signal at an output terminal, and a second current electrode coupled to a voltage reference. The decoupling circuit includes a first inductive element, a first resistor, and a first capacitor coupled together in series between the first current electrode of the power transistor and the voltage reference. The decoupling circuit is for dampening a resonance at a frequency lower than an RF frequency.

RF power transistor circuit

A multiple-path amplifier (e.g., a Doherty amplifier) includes first and second amplifier input terminals and an amplifier output terminal integrally-formed with a semiconductor die, and at least two amplifier cells positioned adjacent to each other between the amplifier input terminals and the amplifier output terminal. Each amplifier cell includes first and second transistors (e.g., field effect transistors) integrally-formed with the semiconductor die, where the first and second transistors each include a transistor input (e.g., a gate terminal) and a transistor output (e.g., a drain terminal). The first transistor input is coupled to the first amplifier input terminal, and the second transistor input is coupled to the second amplifier input terminal. A combining node is coupled to the second transistor output and to the amplifier output terminal, and a first phase shift element (e.g., an inductor) is electrically connected between the first transistor output and the combining node.

Integrated multiple-path power amplifier with interdigitated transistors

A radio frequency (RF) power transistor circuit includes a power transistor and at least one decoupling circuit. The power transistor has a control electrode coupled to an input terminal for receiving an RF input signal, and a current electrode for providing an RF output signal at an output terminal. A decoupling circuit is coupled between the control electrode and a ground terminal, and/or between the current electrode and the ground terminal. The decoupling circuit includes a resistor coupled in series with components of a resonant circuit having a resonance that is lower than an RF frequency (e.g., lower than 20 megahertz). The resistor is for dampening the resonance of the resonant circuit.

RF power transistor circuits

A feed structure for an electrical component includes a slot structure with first and second longitudinal sections opposing one another and first and second interconnect segments opposing one another. The first and second interconnect segments couple the first longitudinal section with the second longitudinal section to form an opening extending through the slot structure, the opening being surrounded by the first longitudinal section, the first interconnect segment, the second longitudinal section, and the second interconnect segment. A first feed node is electrically connected to the slot structure at an intermediate region between first and second ends of the first longitudinal section, and second feed nodes are electrically coupled to the slot structure along the second longitudinal section. In a device or module, the second feed nodes are configured for electrical connection to the electrical component.

Feed structure, electrical component including the feed structure, and module

A radio frequency (RF) chip capacitor circuit and structure are provided. The circuit and structure include a plurality of capacitors connected in series. Each capacitor of the plurality includes a first plate formed from a first metal layer and a second plate formed from a second metal layer. A first two adjacent capacitors of the plurality include first plates formed in a first contiguous portion of the first metal layer or second plates formed in a second contiguous portion of the second metal layer. Each capacitor of the plurality may include a dielectric layer disposed between the first plate and the second plate.

Chip capacitor circuit and structure therefor

An integrated circuit (IC) includes an input pad and an output pad separated from the input pad by a predetermined distance. A plurality of capacitors are coupled in series between the input pad and the output pad. The plurality of capacitors are distributed to substantially span the predetermined distance. An inductor is formed from a bond wire, having a first end attached at the first input pad and a second end attached at the output pad. The inductor and plurality of capacitors configured to form a predetermined open circuit resonance.

Parallel LC resonator and method therefor

An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof

The embodiments described herein provide inverse class F (class F) amplifiers. In general, the inverse class F amplifiers are implemented with a transistor, an output inductance and a transmission line configured to approximate inverse class F voltage and current output waveforms by compensating the effects of the transistor's intrinsic output capacitance for some even harmonic signals while providing a low impedance for some odd harmonic signals. Specifically, the transistor is configured with the output inductance and transmission line to form a parallel LC circuit that resonates at the second harmonic frequency. The parallel LC circuit effectively creates high impedance for the second harmonic signals, thus blocking the capacitive reactance path to ground for those harmonic signals that the intrinsic output capacitance would otherwise provide. This facilitates the operation of the amplifier as an effective, high efficiency, inverse class F amplifier.

Inverse class F amplifiers with intrinsic capacitance compensation

An embodiment of a packaged radio frequency (RF) amplifier device includes a transistor and an inverse class-F circuit configured to harmonically terminate the device. The transistor has a control terminal and first and second current carrying terminals. The control terminal is coupled to an input lead of the device, and the first current carrying terminal is coupled to a voltage reference. The inverse class-F circuit is coupled between the second current carrying terminal and an output lead. The inverse class-F circuit includes a shunt circuit coupled between a cold point node and the voltage reference, where the cold point node corresponds to a second harmonic frequency cold point for the device. The shunt circuit adds a shunt negative susceptance at a fundamental frequency Fto the inverse class-F circuit.

Amplifiers with a short phase path, packaged RF devices for use therein, and methods of manufacture thereof

A semiconductor device, related package, and method of manufacturing same are disclosed. In at least one embodiment, the semiconductor device includes a radio frequency (RF) power amplifier transistor having a first port, a second port, and a third port. The semiconductor device also includes an output lead, a first output impedance matching circuit between the second port and the output lead, and a first additional circuit coupled between the output lead and a ground terminal. At least one component of the first additional circuit is formed at least in part by way of one or more of a plurality of castellations and a plurality of vias.

Growing community of inventors

Tempe, AZ, United States of America

Hussain Hasanali Ladhani