Shpp Global Technologies B.v.

Sabic Global Technologies B.v.

Huseyin Tas

Eylem Tarkin-Tas

Alvaro Carrillo

Mark R Denniston

Nikhil Verghese

Compatibilizing materials for use with fibers and polymeric compositions are described. A compatibilizing material can include a silane (Si) modified polyphenylene ether (PPE) oligomer having a resin reactive functional group. The resin reactive functional group can be between the PPE moiety and a Si moiety. In other instances, the resin reactive functional group can be a substituent of the Si moiety.

Poly (phenylene ether) based compatibilizing material

A poly(arylene ether) copolymer is the product of oxidative copolymerization of monomers including a monohydric phenol and a dihydric phenol of the formula wherein R, R, R, and Rare as defined herein. The poly(arylene ether) copolymer includes less than 0.1 weight percent of incorporated amine groups. A method of the manufacture of a poly(arylene ether) copolymer is also disclosed. A curable composition including the poly(arylene ether) copolymer and cured products derived therefrom are also described.

Poly(arylene ether) copolymer

A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol and a dihydric phenol in a non-halogenated solvent is useful in curable compositions. The copolymer has less than 0.5 weight percent monohydric phenols having identical substituents in the 2- and 6-positions of the phenolic ring, and an absolute number average molecular weight of 1,000 to 10,000 grams/mole. A solution of a poly(phenylene ether) copolymer derived from 2-methyl-6-phenylphenol, 2,6-dimethylphenol, and a dihydric phenol in a non-halogenated solvent is also useful in curable compositions. This copolymer has an absolute number average molecular weight of 1,000 to 5,000 grams/mole. A cured composition is obtained by heating curable compositions composed of the poly(phenylene ether) copolymer solutions and thermoset resins for a time and temperature sufficient to evaporate the non-halogenated solvent and effect curing. The compositions can be used for preparation of composites for printed circuit boards.

Poly(phenylene ether) copolymer compositions and associated methods and articles

A poly(phenylene ether) copolymer of 2-methyl-6-phenylphenol and a dihydric phenol having an absolute number average molecular weight of 1,000 to 10,000 grams/mole is made by polymerization of 2-methyl-6-phenylphenol and a dihydric phenol in the presence of molecular oxygen, a polymerization catalyst comprising a metal ion and at least one amine ligand, and a solvent composed of at least 95 weight percent of a C-Calcohol selected from methanol, ethanol, 1-propanol, and 2-propanol. The poly(phenylene ether) copolymer can be, for example, a copolymer of 2-methyl-6-phenylphenol, 2,2-bis(3,5-dimethyl-4-hydroxyphenol)propane, and optionally 2,6-dimethylphenol. The poly(phenylene ether) copolymer finds utility in curable compositions, cured compositions, and articles.

Poly(phenylene ether) copolymer process and compositions

A phenylene ether oligomer has repeating units of the structure and less than 30 weight percent of repeating units derived from a monohydric phenol having identical substituents in the 2- and 6-positions, wherein the phenylene ether oligomer includes a vinyl benzene ether end group, an amine end group, maleimide end group, a norbornene end group, an anhydride end group, or a combination comprising at least one of the foregoing. The phenylene ether oligomer can be used to provide a curable composition. The curable composition can be cured to provide a thermoset composition. Articles comprising the thermoset composition are also described.

Phenylene ether oligomer, curable composition comprising the phenylene ether oligomer, and thermoset composition derived therefrom

A capped poly(arylene ether) copolymer having the formula wherein   and

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Delmar, NY, United States of America

Huseyin Tas