Industrial Technology Research Institute

Quanta Computer Incorporated

Intellectual Property Innovation Corporation

Hung-Yi Chen

Shu-Tang Yeh

Jane-Hway Liao

Hong-Ming Dai

Yen-Ching Kuo

Chien-Chang Hung

Yi-Hsiang Huang

Wen-Lung Chen

An embodiment of the disclosure provides a heater package including a substrate, a first barrier layer, at least one heater, and a second barrier layer. The first barrier layer is disposed on a surface of the substrate and has a first treatment layer on a side away from the substrate. The heater is disposed on the substrate and includes a heating layer and at least one electrode. The at least one electrode and the heating layer contact with each other. The second barrier layer covers an upper surface and a sidewall of the heater and has a second treatment layer on an opposite side or the side away from the substrate. A ratio of a thickness of the first treatment layer to a thickness of the first barrier layer and a ratio of a thickness of the second treatment layer to a thickness of the second barrier layer range from 0.03 to 0.2.

Heater package

The disclosure provides an electronic device. The electronic device includes a stretchable substrate, a plurality of electronic elements, and at least one connection element. The electronic elements and the connection element are disposed on the stretchable substrate. The connection element is disposed between two adjacent electronic elements, and the two adjacent electronic elements are electrically connected to each other via the connection element. Each electronic element may include at least one functional unit and an electrode, wherein the electrode is in direct contact with the functional unit. The connecting element includes at least one stretchable conductive unit and at least one buffer conductive unit, wherein the buffer conductive unit contacts the electrode, and the stretchable conductive unit is electrically connected to the electrode through the buffer conductive unit. The yield strain of the stretchable conductive unit is greater than the yield strain of the buffer conductive unit.

Electronic device

A package of photoelectric device including a substrate, at least one photoelectric device, a first barrier layer, a wavelength-converting layer, and a second barrier layer is provided. The photoelectric device is disposed on the substrate. The first barrier layer is disposed on the substrate and covers the photoelectric device. The wavelength-converting layer is disposed on the first barrier layer. The second barrier layer covers the wavelength-converting layer. A composition of the first barrier layer includes a nitrogen content of more than 0 atomic percent (at %) to 10 at %, an oxygen content of 50 at % to 70 at %, and a silicon content of 30 at % to 50 at %.

Package of photoelectric device

A Universal Serial Bus (USB) power supply method is provided. The method is applied to a USB client device to charge a battery of the USB client device. The USB client device is connected to a USB host device via a USB connection including a D+ signal wire and a D&#x2212; signal wire. The USB power method includes: determining whether the USB host device is a dedicated charging port (DCP) in response to a connection event, providing a verification signal to the USB host device if the USB host device is a DCP, determining whether a verification response signal from the USB host device is received, and driving the USB host device to provide an auxiliary charging current via the D+ and D&#x2212; signal lines for charging the battery when the verification response signal is received.

Growing community of inventors

Taipei, Taiwan

Hung-Yi Chen