Azurewave Technologies, Inc.

Hung-Wei Lin

Kung-An Lin

Hsiang-Yun Cheng

Chung-Che Yang

A flip-chip light-emitting module includes a thermal dissipation substrate, a package assembly, and a light-emitting chip. The package assembly includes a frame surrounding the thermal dissipation substrate, and a lens unit disposed on the frame. The frame includes a conductive path. The light-emitting chip is disposed on the thermal dissipation substrate, and includes a top conductive contact and a light-emitting surface at the same side. The top conductive contact is electrically connected with the conductive path by a conductor.

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Taipei, Taiwan

Hung-Wei Lin