Vanguard International Semiconductor Corporation

Hung-Wei Chen

Shao-Chang Huang

Chieh-Yao Chuang

Jung-Tsun Chuang

Ching-Wen Wang

Shi-Hsiang Lu

Chi-Li Tu

Chih-Hsuan Lin

Li-Fan Chen

Chun-Chih Chen

Ting-You Lin

Yu-Kai Wang

Yin-Ting Lin

Shang-Chuan Pai

Wei-Chung Wu

Szu-Chi Chen

Sheng-Chih Chuang

Pei-Chun Yu

Han-Pei Liu

A control circuit providing an output voltage and including an N-type transistor, a first P-type transistor and a second P-type transistor is provided. The N-type transistor is coupled to a first power terminal. The first P-type transistor includes a first source, a first drain, a first gate and a first bulk. The first gate is coupled to a gate of the N-type transistor. The first bulk is coupled to the first source. The second P-type transistor includes a second source, a second drain, a second gate and a second bulk. The second source is coupled to a second power terminal. The second drain and the second bulk are coupled to the first bulk.

Control circuit and operating circuit utilizing the same

An ESD protection circuit, which protects a subject NMOS transistor coupled between an I/O pad and a ground, includes a first discharge device arranged between the I/O pad and the ground, having a trigger-on voltage that is lower than a breakdown voltage of the subject NMOS transistor; and a gate voltage control device, including a discharge NMOS transistor coupled to the ground and a gate of the subject NMOS transistor; a first PMOS transistor connected to the gate of the subject NMOS transistor and a connection node; and a first NMOS transistor connected to the connection node and the ground. The connection node is connected to the gate of the discharge NMOS transistor, and the gate of the first PMOS transistor and the gate of the first NMOS transistor are connected to each other.

Electrostatic discharge protection circuit

An electrostatic discharge (ESD) protection circuit is provided. A detector is coupled between a first input-output pad and a second input-output pad and detects the voltage levels of the first and second input-output pads to generate a detection signal. A inverter generates a control signal according to the detection signal. A control element is coupled between the first input-output pad and a first node. A current release element is coupled between the first node and the second input-output pad. When the detection signal is at a specific level, the control element and the current release element provide a discharge path to release an ESD current from the first input-output pad to the second input-output pad. When the detection signal is not at the specific level, the control element and the current release element do not provide a discharge path.

A method for fabricating a bonding pad structure includes forming a dielectric layer on a substrate; forming a first metal pattern layer in the dielectric layer. The first metal pattern layer includes a first body portion having a plurality of first openings in a central region of the first body portion and a plurality of second openings arranged along a peripheral region of the first body portion and surrounding the plurality of first openings; and a plurality of first island portions correspondingly disposed in the plurality of second openings and spaced apart from the first body portion. The method further includes forming a plurality of first interconnect structures in the dielectric layer and corresponding to the plurality of first island portions; and forming a bonding pad on the dielectric layer and directly above the first metal pattern layer.

Bonding pad structure having island portions and method for manufacturing the same

A power-on control circuit controlling a first output switch and a second output switch is provided. A detecting circuit detects a first voltage to generate a detection signal to a first node. A switching circuit receives the first voltage and a second voltage and transmits the first or second voltage to a second node according to the voltage level of the first node. A setting circuit generates a feedback signal to the first node according to a voltage level of the second node. When the first voltage reaches a first pre-determined value and the second voltage has not reached a second pre-determined value, the switching circuit transmits the second voltage to the second node. When the second voltage reaches the second pre-determined value, the switching circuit transmits the first voltage to the second node.

Power-on control circuit

A power-on control circuit is provided. The power-on control circuit includes first and second power terminals, a switch circuit, an inverter chain circuit, and a capacitor. The switch circuit has a control terminal receiving a first control signal, an input terminal coupled to the second power terminal, and an output terminal coupled to a first node. The inverter chain circuit has an input terminal coupled to the first node and generates the first control signal. The capacitor is coupled between the first node and a ground. When the first power terminal receives a first voltage and the second power terminal does not receive a second voltage, the switch circuit is turned on according to the first control signal. When the first power terminal receives the first voltage and the second power terminal receives the second voltage, the switch circuit is turned off according to the first control signal.

Power-on control circuit and input/output control circuit

A power-on control circuit is provided. A first detection circuit detects the voltage of a first voltage source to generate a first detection signal to a first node. A switching circuit is coupled to the first voltage source and a second voltage source and outputs the voltage of the first voltage source or the voltage of the second voltage source to a second node according to the voltage level of the first node. A first buffer generates a feedback signal and a control signal according to the voltage level of the second node. A second detection circuit generates a second detection signal according to the feedback signal, the control signal, the voltage of the second voltage source and a recovery signal. A second buffer generates the recovery signal according to the second detection signal.

Power-on control circuit with state-recovery mechanism and operating circuit utilizing the same

A bonding pad structure is provided. The structure includes a dielectric layer on a substrate. A bonding pad is disposed on the dielectric layer and a first metal pattern layer is embedded in the dielectric layer and directly below the bonding pad. The first metal pattern layer includes a first body portion and first island portions. The first body portion has first openings in a central region of the first body portion and second openings arranged along a peripheral region of the first body portion and surrounding the first openings. The first island portions are correspondingly disposed in the second openings and spaced apart from the first body portion. First interconnect structures are disposed in the dielectric layer and correspond to the first island portions, such that the bonding pad is electrically connected to the first island portions.

Growing community of inventors

Jhubei, Taiwan

Hung-Wei Chen