Presidio Components. Inc.

Other

Presido Components, Inc.

Hung Van Trinh

Alan D Devoe

Lambert T Devoe

Daniel Devoe

A monolithic ceramic capacitor has a plurality of dielectric layers and a plurality of conductive layers sintered together to form a substantially monolithic ceramic body. The ceramic body defines at least one void between the dielectric and conductive layers. The void is at least partially enclosed within the ceramic body and bounded by at least a portion of a dielectric layer, a first conductive layer, and a second conductive layer. Within the dielectric body, the first and second conductive layers are connected in a nonconductive manner.

Multilayer broadband ceramic capacitor with internal air gap capacitance

A rotatable electroplating barrel for electroplating articles, the electroplating barrel having a proximal end with a centrally formed aperture and a distal end with at least one helical rib extending circumferentially along a longitudinal axis and between the proximal end and the distal end. The at least one helical rib, proximal end, and distal end of the electroplating barrel are formed integrally as a unitary piece and have a contiguous perforated outer wall configured to couple directly to the proximal and distal ends, extending therearound to enclose the at least one helical rib.

Helically ribbed electroplating barrel

A multilayer chip capacitor includes electrodes comprised of numerous, closely spaced conductive layers. Adjacent conductive layers are essentially non-overlapping, so that fringe capacitance between opposing electrodes provides substantially all of the capacitance. The conductive layers may be shaped to form a non-planer boundary between electrodes. An additional high frequency integrated capacitor is formed from external electrode plates. The non-planar electrode boundary principle is also applied to discoidal capacitors in the form of a non-concentric electrode boundary.

High voltage fringe-effect capacitor

A multilayer chip capacitor includes electrodes comprised of numerous, closely spaced conductive layers interposed within a dielectric laminate. Adjacent conductive layers are essentially non-overlapping, so that fringe capacitance between opposing electrodes provides substantially all of the capacitance. The conductive layers may be shaped to form a non-planer boundary between electrodes. An additional high frequency integrated capacitor is formed from external electrode plates. The non-planar electrode boundary principle is also applied to discoidal capacitors in the form of a non-concentric electrode boundary.

An electrical device for soldering to a circuit board with a solder includes a capacitor, a lead frame including a solder dam, and a solder joint electrically coupling the capacitor to the lead frame. The solder dam includes one of a physical barrier to flow or an area of reduced wettability to the solder. The solder dam is between the solder joint and the circuit board. The solder dam is on one or both of a lead portion and main portion of the lead frame. In one embodiment, the first solder dam extends substantially the full width of the first lead portion. The solder dam may be a barrier and/or include a metal oxide. A method of manufacturing the device includes soldering a lead frame to a capacitor with a solder and modifying a surface on the lead frame to include a physical barrier and/or an area of reduced wettability.

Electrical devices with solder dam

Electrical devices and methods for manufacturing same

A method is provided for concurrently forming terminals on a multilayer capacitor having a first plurality of interior plates with edges that are brought to and exposed upon a first surface and a second plurality of interior plates, interleaved with the first plurality of interior plates, and spaced from the first plates by a dielectric. The second plurality of interior plates has edges that are brought to and exposed upon a second surface, which is not adjacent to the first surface. A first terminal is formed by plating a layer of electrically-conductive first metal directly onto the first surface including where the edges of the first plates are exposed upon the first surface and concurrently forming a second terminal by plating a layer of electrically-conductive first metal directly onto the second surface including where the edges of the second plates are exposed upon the second surface.

Multilayer ceramic capacitor with terminals formed by plating

A multilayer ceramic capacitor and method of creating are provided. The capacitor includes a plurality of interior plates having edges that are brought to and exposed upon a first surface and also upon a portion of a second surface of the capacitor at a region where the second surface meets the first surface. An electroplated terminal is directly in contact with and mechanically and electrically connected to an edge of each of the interior plates where each plate's edge is exposed upon the first surface. The terminal wraps over the region of the capacitor from the first surface onto the portion of the second surface and is directly in contact with and mechanically and electrically connected to an edge of each of the interior plates where each plate's edge is exposed upon the second surface. The terminal does not extend to any additional surfaces which meet the first surface.

Multilayer ceramic capacitor with terminal formed by electroless plating

A terminal to, most commonly, a ceramic capacitor, most commonly a multilayer ceramic capacitor (MLCC), is formed by electroless plating, also known as electroless deposition or simply as electrodeposition. In the MLCC having a multiple parallel interior plates brought to, and exposed at, at least one, first, surface, an electrically-conductive first-metal layer, preferably Cu, is electrolessly deposited upon this first surface directly in contact with, mechanically connected to, and electrically connected to, the edges of these interior plates. Lateral growth of the electrolessly-deposited first-metal is sufficient to span from exposed plate to exposed plate, electrically connecting the plates. One or more top layers, preferably one of Ni and one of Sn and Pb, are deposited, preferably by plating and more preferably by electrolytic plating, on top of the electrolessly-deposited Cu.

A monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance, a printed circuit board having the capacitor mounted thereon, and a method of making. Sheets of green-state ceramic dielectric material and glass/metal composite material are laminated together, diced into individual chips, and fired to sinter the glass and the ceramic together. The composite material contains an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the printed circuit board. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Method of making an essentially monolithic capacitor

A method of making a monolithic or essentially monolithic single layer capacitor with high structural strength and capacitance. Sheets of green-state ceramic dielectric material and ceramic/metal composite material are laminated together, diced into individual chips, and fired to sinter the ceramic together. The composite material may contain an amount of metal sufficient to render the composite conductive whereby the composite may be used for one or both electrodes and for mounting the capacitor to the pc board. Alternatively, the composite material may contain an amount of metal insufficient to render the composite conductive but sufficient to act as seed points for an electroplating process wherein the composite is preferentially coated with conductive metal, and the coated composite is mounted to the pc board and the coating provides an electrical connection to an internal electrode. Vertically-oriented surface mountable capacitors and hybrid capacitors are provided.

Growing community of inventors

San Diego, CA, United States of America

Hung Van Trinh