Finisar Corporation

International Business Machines Corporation

Western Digital Technologies, Inc.

Maxtor Corporation

Microsemi Corporation

Hung V Nguyen

Andrew Ching Tam

Peter Michael Baumgart

Thao Anh Nguyen

Joshua Moore

Wing P Leung

Anthony W Wu

Stephen T Nelson

Erhard Theodor Schreck

Andrew W Vogan

Lee K Dorius

Donald Joseph Brunnett

Taichi Nakamura

Yong Hu

Bruce C Schardt

YongShan Zhang

Charles Steven Joiner

Jingyun Zou

Victor Jacob Lerner

A slider may include a first side-edge surface, a second side-edge surface, and an air-bearing surface (ABS) comprising: a first side cavity adjacent to the first side-edge surface, and a first island side blocker situated at a mouth of the first side cavity, wherein: a first outer surface of the first island side blocker forms a portion of the first side-edge surface, a second outer surface of the first island side blocker is recessed from the first side-edge surface, a first side opening is situated on a leading side of the first island side blocker, and a second side opening is situated on a trailing side of the first island side blocker.

Slider air bearing designs with side blocker for contamination robustness

Optical subassembly grounding in an optoelectronic module. In one example embodiment, a conductive OSA grounding gasket assembly includes a top gasket and a bottom gasket. The top gasket includes a top shell surface and a top OSA surface. The top shell surface is configured to be in direct physical contact with a conductive top shell of an optoelectronic module. The top OSA surface is configured to make direct physical contact with a conductive housing of an OSA. The bottom gasket includes a bottom OSA surface and a bottom shell surface. The bottom OSA surface is configured to be in direct physical contact with the conductive housing of the OSA. The bottom shell surface is configured to make direct physical contact with a conductive bottom shell of the optoelectronic module.

Optical subassembly grounding in an optoelectronic module

A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules.

Spider clip for securing a circuit board within a communications module

A method for a calibration module to calibrate laser bias current in an optical transceiver. The method comprises causing the calibration module to configure a control module of the optical transceiver for a calibration operation, causing the calibration module to determine a laser bias current monitored by the control module, and determining one or more calibration factor values that cause the laser bias current monitored by the control module to substantially match a laser bias current as measured by an external test meter.

Laser driver bias current calibration

A distributed amplifier may include an input transmission line for receiving on an input end an input signal, and an output transmission line for outputting on an output end an output signal. A plurality of amplifier stages may be coupled between intermediate positions on the input and output lines. Feedback impedance may negatively feed back a signal on the output end of the output line to a second end of the input line spaced from the first end of the input line.

Distributed amplifier with negative feedback

In one example embodiment, a printed circuit board positioning mechanism includes a solderable plate and a compressible structure attached to the solderable plate.

Printed circuit board positioning mechanism

A disk drive includes a rotatable data storage disk, a transducer, an actuator, and a controller. The transducer is configured to read and write data on the disk. The actuator is configured to position the transducer relative to defined portions of the disk. The controller is configured to determine how many times data has been written to the defined portions of the disk. The controller is also configured to refresh data residing at a particular one of the defined portions of the disk when the number of times data has been written to the particular defined portion of the disk satisfies a threshold value.

Disk drive that refreshes data on portions of a disk based on a number of write operations thereto

A magnetic recording disk with a glass substrate is textured by a process which creates an array of bumps in a magnetic head contact start and stop (CSS) region of the disk. The texturing process uses a laser to provide pulses of predetermined energy fluence on the glass substrate to produce a plurality of raised bumps in the substrate surface, each bump having a surface elevation controllable to within a few nanometers. The bumps are created without unwanted micro-cracking or ejection of surface material by exploiting a narrow operating region below the abrupt thermal shock fluence threshold of the glass substrate. This textured glass substrate provides the magnetic recording disk with improved stiction, wear, coatability and sensor flying height properties.

Textured data storage disk having a brittle nonmetallic substrate

A process for creating an array of bumps to texture a brittle nonmetallic surface, such as a glass substrate for data recording disks. The texturing process uses a laser to provide pulses of proper energy fluence to the brittle glass surface to produce a plurality of raised bumps in the surface. The bump creation is accomplished without unwanted micro-cracking or ejection of surface material by limiting the laser pulse fluence to a value in a narrow operating region discovered below the abrupt thermal shock fluence threshold for the brittle nonmetallic surface material. The process is also applicable to other brittle surface textures, such as those intended for use as 'stamping surfaces' for the contact reproduction of the negative of a surface pattern, such as an optical disk.

Growing community of inventors

San Jose, CA, United States of America

Hung V Nguyen