Opto Tech Corporation

Hung-Tung Wang

Chien-Chen Hung

Shun-Chih Chen

Cheng-Wei Yang

Shun-Lih Tu

Chih-yuan Yen

Huai-Ku Chung

Chun-Fang Hsiao

Chia-Feng Yang

Fang-Shih Chuang

Chih-Hung Chuang

Tsu-An Han

According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.

LED array package structure and method thereof

A smart light emitting diode cluster and system includes a central processing unit (CPU) and a plurality of LED cluster strings, each comprising a plurality of LED cluster connected in series. Each LED cluster includes an LED drive circuit and a plurality of LEDs. The CPU receives external input image signal, and then desired control signal and image data are sent to the LED cluster strings by appropriate processing. The control signal is used to switch the LEDs in the cluster to generate desired image and related color variation. The control signal and image data are transferred to the next LED cluster by the present LED drive circuit. In this manner, the control signal and image data are progressively transferred from the first to the last cluster so that a whole image with color variation can be displayed by all the LEDs in the system.

Smart light emitting diode cluster and system

Growing community of inventors

Hsinchu, Taiwan

Hung-Tung Wang