Cisco Technology, Inc.

Hung-Ting Lin

Kuang Hsin Hsu

George Youzhi Yi

William Jeffrey Lewis

Hsi-sheng Chen

George Youhzi Yi

A circuit board includes a first circuit board section which is configured to support a set of light emitting diodes, a second circuit board section which is configured to support high-speed electronic circuitry, and a boundary section which defines an EMI boundary between the first circuit board section and the second circuit board section. The boundary section includes a set of outer surface elongated ground strips configured to form an EMI seal onto which a set of EMI shields is capable of mounting. In some arrangements, the set of outer surface elongated ground strips take the form of metallic bands (e.g., layers of copper). Such bands can be integrated into the circuit board itself (e.g., during PCB fabrication), or added onto one or more of the circuit board surfaces (e.g., after PCB fabrication).

Techniques for providing an EMI seal for a circuit board

Module assembly

A chassis utilizes spring fingers having contact portions and mid portions where each spring finger forms multiple cantilevers to provide different spring constants. Accordingly, the increase in force resulting from displacement can be better controlled and even minimized for certain ranges of displacement. In particular, each spring finger can be configured to perform in an operating range characterized by a smaller spring constant. As a result, the force increase in this operating range is slower thus accommodating circuit boards with large connector height variations without significantly changing the normal contact force. Such operation enables the chassis to consistently pass EMI and ESD testing, as well as provide more reliable device operation.

Chassis with multi-cantilever spring fingers for EMI shielding and ESD protection of electronic devices

Growing community of inventors

Taipei, Taiwan

Hung-Ting Lin