Hon Hai Precision Industry Co., Ltd.

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Hung-Ming Chen

Hsieh-Chih Chiang

Tai-An Tsao

Lei Han

Pei-Hsuan Lee

Yu-Hsiang Cheng

Kuang-Shing Chen

Xiaomeng Chen

Xiao-Yu Liu

Ting-Yu Wang

A high atomic number material is applied to one or more surfaces of a semiconductor structure of a wafer. The one or more surfaces are at a depth different from a depth of a surface of the wafer. An electron beam is scanned over the semiconductor structure to cause a backscattered electron signal to be collected at a collector. A profile scan of the semiconductor structure is generated based on an intensity of the backscattered electron signal, at the collector, resulting from the high atomic number material. The high atomic number material increases the intensity of the backscattered electron signal for the one or more surfaces of the semiconductor structure such that contrast in the profile scan is increased. The increased contrast of the profile scan enables accurate critical dimension measurements of the semiconductor structure.

Semiconductor structure inspection using a high atomic number material

A pivot mechanism rotatably coupes a cover to a base of a foldable electronic device. The pivot mechanism includes a connector, a first rotation assembly, and a second rotation assembly. The first rotation assembly is rotatably coupled to the base and fixedly attached to the connector. The second rotation assembly is fixedly coupled to the cover and rotatably coupled to the connector. The first rotation assembly rotates relative to the base and the second rotation assembly remains fixed relative to the connector as the cover is rotated open to a first angle. The second rotation assembly rotates relative to the connector as the cover is rotated further to a second angle.

Pivot mechanism of foldable electronic device

An electronic device comprises a main body, a plurality of I/O interfaces, and an ejecting apparatus. The ejecting apparatus is mounted on the main body and comprises an enclosure, a supporting member received in the enclosure, a carrier secured on the supporting member to support the I/O interfaces, a first driving unit, and a second driving unit. The first driving unit drives the carrier to slide along a first direction, and the second driving unit drives the carrier to slide along a second direction opposite to the first direction. When the I/O interfaces are exposed out of the enclosure, the first force is larger than the second force. When the carrier is operated to slide to a position where the second force is larger than the first force, the I/O interfaces are driven to be received in the enclosure.

Ejecting apparatus and electronic device employing the ejecting apparatus

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Taipei, Taiwan

Hung-Ming Chen