Micro-star Int'l Co., Limited.

Benq Corporation

Feng Chi Biotech Corporation

Hung Ming Chang

Chien Hsing Lin

Li-Kuan Wong

Shu Ming Chang

Tsung-Hsi Yu

A method for detecting a SNP site on a SMA gene is disclosed, and includes steps of: (S) performing a PCR for amplifying a nucleic a nucleic acid fragment containing a SNP site; (S) performing a dephosphorylation reaction on the nucleic acid fragment; (S) performing an extension reaction on the nucleic acid fragment, wherein the SNP site is identified by using an extension primer, a 3'-end of the extension primer is extended by a single nucleotide which is complementary to a base of the SNP site, and thus an extended extension primer is obtained; (S) performing a purification reaction; and (S) measuring a molecular weight of the extended extension primer, and determining a type of a base of the single nucleotide based upon the molecular weight, thereby determining whether deletion occurs to the SNP site.

Method for detecting SNP site on SMA gene

A heat dissipating device for taking away heat from a plurality of heat sources is disclosed. It includes a plurality of heat sinks installed on heat sources and a heat conductor connected to the heat sinks. When a temperature difference is generated among the heat sources in work, the heat conductor can pass the heat from a hot heat sink to cooler ones. This enables heat transfers among the heat sinks to increase the heat dissipating efficiency.

Heat dissipating device

A computer system includes a processor for processing data, a storage unit for storing data, and a liquid cooling thermal module for dissipating heat generated by the processor. The thermal module has a liquid coolant carrying pipe adjacent to the processor for conducting heat, and a cooling device. The cooling device has a plurality of tanks, which are connected with each other.

Computer system with a liquid-cooling thermal module having a plurality of pumps

An integrated heat-dissipating module includes a heat-dissipating device substantially in contact with a main heat-generating source on a motherboard, a casing capping over the main heat-generating source and substantially in contact with sub heat-generating sources installed around the main heat-generating source, and a heat-dissipating fan installed on a first vent of the casing. The heat produced by the main heat-generating source is transmitted to the air inside the casing via the heat-dissipating device. Then, the hot airflow concentrated within the casing is expelled from a second vent of the casing by the heat-dissipating fan. The casing is made of a high heat conducting material and has a plurality of external heat-dissipating fins extending outward from an outer surface of the casing for quickly transmitting the heat generated by the sub heat-generating sources to the outside. Heat produced by the main heat-generating source and the sub heat-generating sources is dissipated simultaneously.

Integrated heat-dissipating module

The present invention provides a heat-sinking apparatus for a light pipe. The light pipe is disposed on an optical engine of a projector and optically couples with a light source. The heat-sinking apparatus includes a cover made of a heat conductive material and a fan. The cover covers the light pipe and uniformly distributes thermal energy generated by the light source over the light pipe. The fan dissipates the thermal energy distributed over the light pipe.

Growing community of inventors

Taipei, Taiwan

Hung Ming Chang