Foxsemicon Integrated Technology, Inc.

Hung-Kuang Hsu

Chun-Wei Wang

Wen-Jang Jiang

Chih-Ming Lai

Chih-Peng Hsu

Ying-Chieh Lu

Ping-Yu Chen

Chih-Chung Tsao

Yuan-Fa Chu

Tse-An Lee

Meng-Hua Wang

Pei-Chin Lee

Chih-Wei Lin

Su-Chi Chang

Shiao-Wen Lu

An LED device includes a substrate, a plurality of LEDs, a first light pervious layer, a reflective plate, and a plurality of phosphor particles contained in the first light pervious layer. The LEDs are electrically mounted on the substrate and configured for emitting light of a first wavelength. The reflective plate is mounted on the substrate for directing the light of the first wavelength to transmit through the first light pervious layer. The phosphor particles are configured for converting the light of the first wavelength into light of a second wavelength. A distribution of the phosphor particles in the first light pervious layer gradually decreases from a center to a periphery thereof.

Light emitting diode device

A street lamp system includes an illumination device, a display unit and a control module. The display unit is configured for displaying oncoming traffic information. The control module is communicatively coupled to the illumination device and the display unit, for sending a first signal to the display unit for displaying the traffic information, and sending a second signal to the illumination device to increase illumination brightness of the illumination device.

Street lamp system

A solid state light emitting device includes a laminated substrate structure (), an LED chip (), a transparent capsulation material () and an electric component (). The laminated substrate structure includes a first substrate () and a second substrate () attached to each other by a sintering process. The first substrate has a mounting surface () and a receiving through hole () defined in the mounting surface thereof. The LED chip is mounted on the mounting surface of the first substrate. The transparent capsulation material envelops the LED chip therein. The electric component is received in the receiving hole and mounted on the second substrate. The electric component is located below the mounting surface of the first substrate.

Solid state light emitting device

An LED includes a substrate having a substantially flat substrate surface, a plurality of electrodes extending through the substrate, an LED chip configured for emitting light, a first and a second coplanar reflective layers formed on the surface, and a light pervious encapsulation member mounted on the substrate surface. The light pervious encapsulation member covers the LED chip and the first reflective layer and a portion of the second reflective layer. The LED chip is mounted on the substrate surface and electrically connected with the electrodes. The first reflective layer and the second reflective layer are configured for reflecting the light emitted from the LED chip.

Light-emitting diode

A light source module of light emitting diode includes a substrate having circuits, a light-converted component, and several of light emitting diodes. The light-converted component includes a transparent substrate and a fluorescence material layer positioned on the transparent substrate. The fluorescence material layer is divided into a central region and several of surrounding regions surrounding the central region. The central region has a greatest concentration of fluorescence material. The concentration of fluorescence material in the surrounding regions decreases from the center to the outer periphery of the fluorescence material layer. The light emitting diodes form an array and are positioned on the substrate between the substrate and the fluorescence material layer. Each of the light emitting diodes is electrically connected to the circuits.

Light source module of light emitting diode

An exemplary light emitting diode includes a substrate, a LED chip, a first heat conductor, and a second heat conductor. The substrate comprises a first surface and an opposite second surface. The LED chip is positioned on the first surface of the substrate and it has a first electrode and a second electrode. The first heat conductor is attached to the second surface of the substrate and electrically connected to the first electrode of the LED chip. The second heat conductor is extending through the first heat conductor and insulated from the second heat conductor, and electrically connected to the second electrode of the LED chip.

Light emitting diode and light source module having same

An exemplary illuminating device includes a light source container, a light source and a drying chamber. The light source container includes a receiving room. The light source is received in the receiving room. The drying chamber has desiccant received therein and communicates with the receiving room. The desiccant is configured for absorbing moisture in the illuminating device, therefore, drying the illuminating device.

Illuminating device with drying agent

An LED based light source assembly () comprises a circuit board (), a plurality of LEDs (), a heat sink () and a plurality of fasteners (). The circuit board comprises a first surface () and a second surface () opposite to the first surface. The first surface is provided with electrical conductive traces (). The plurality of LEDs are arranged on the first surface of the circuit board and electrically connecting with the electrical wires of the circuit board. The heat sink thermally contacts the second surface of the circuit board. The plurality of fasteners each comprise a first end () and a second end () opposite to the first end. The first end of each of the fasteners abuts on the first surface of the circuit board. The second end of each of the fasteners extends through the circuit board to be secured to the heat sink.

Light emitting diode based light source assembly

An illuminating device () includes a light source module () and a power source module (). The light source module includes a base (), a plurality of LEDs () and a plurality of electrode contacts () located on the base. The LEDs is electrically connected to the electrode contacts. The power source module includes an enclosure () defining a light source chamber () therein and a plurality of electrical terminals () received in the light source chamber. The light source module is detachably inserted into the light source chamber of the power source module, and the electrode contacts abut against the corresponding electrical terminals respectively.

Light emitting diode illuminating device

A lighting apparatus includes a reflector, a light source, and a lens unit. The reflector has an open side, and a reflective surface that extends from a periphery of the open side and that defines a compartment. The light source is disposed in the compartment and emits light toward the reflective surface. The reflective surface reflects the light from the light source towards the open side. The lens unit is disposed to close the open side and permits passage of the light reflected by the reflective surface therethrough. The lens unit includes a central lens portion, and first and second side lens portions respectively disposed on two sides of the central lens portion. The central lens portion and the first and second side lens portions are Fresnel lenses, and are configured to redirect the light passing therethrough to result in rectangularly-distributed illumination outwardly of the lighting apparatus.

Lighting apparatus

A backlight module includes a light guide plate, a light source and a ventilating tube. The light guide plate includes a light exiting surface and a light incident surface adjacent the light exiting surface. The light source includes a plurality of light emitting diodes facing the light incident surface of the light guide plate. The ventilating tube is thermally connected to the light source. The ventilating tube defines an air inlet in one first end, an air outlet in an opposite second end, and an air passage channel interconnecting the air inlet to the air outlet. The air outlet is at a higher altitude than the air inlet along a gravitational force direction.

Backlight module

An illuminating device includes a light source module and a power supply module. The light source module includes a substrate, at least one solid state light emitting element, and a plurality of first heat-conducting fins. The substrate has a first surface and an opposite second surface. The at least one solid state light emitting element is arranged on the first surface. The first heat-conducting fins are formed on the second surface. The power supply module includes a housing with a slot formed therein. The housing includes a heat-conducting bottom plate and a plurality of second heat-conducting fins formed on the heat-conducting bottom plate. The light source module is detachably inserted in the slot with the first heat-conducting fins interleaved with the second heat-conducting fins and in thermal contact with the heat-conducting bottom.

Illuminating device

A light source device includes a circuit board, a solid state lighting element, and a hollow cylindrical metal reflector. The circuit board has a circuit layer formed thereon. The solid state lighting element is placed on the circuit board and electrically connected to the circuit layer. The hollow cylindrical metal reflector is placed on the circuit board and insulated from the circuit layer. An inner surface of the reflector surrounds the solid state lighting element to reflect and direct light from the solid state lighting element towards an opposite side of the reflector to the solid state lighting element.

Light source device with high heat-dissipation efficiency

A solid state light illuminator includes a solid state lighting element, a primary coil, and a secondary coil. The secondary coil and the solid state lighting element cooperatively form a circuit. The secondary coil couples electromagnetically with the primary coil. The primary coil is adapted for electrically connecting to an AC power source to generate an alternating magnetic field. The alternating magnetic field generates an induced electromotive force in the secondary coil to apply an electrical current to the solid state lighting element.

Solid state light illuminator

A lamp assembly () is provided. The lamp assembly includes a lamp cover () having a first end () and an opposite second end (). The lamp cover tapers from the second end to the first end. A hydrophobic coating () is formed on and covers an outer surface of the lamp cover. A light source () is received in the lamp cover.

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Miao-Li Hsien, Taiwan

Hung-Kuang Hsu