Advanced Semiconductor Engineering, Inc.

Hung-Jen Yang

Min-Lung Huang

Chuehan Hsieh

Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof.

Semiconductor device packages, redistribution structures, and manufacturing methods thereof

A semiconductor device package includes a semiconductor device, a sealant, a first dielectric layer, an electrically conductive layer, and a second dielectric layer. The semiconductor device includes a contact pad, an active surface, and side surfaces, where the contact pad is disposed adjacent to the active surface. The semiconductor device is formed with a first alignment mark that is disposed adjacent to the active surface. The sealant envelopes the side surfaces of the semiconductor device and exposes the contact pad. The first dielectric layer is disposed adjacent to the sealant and the active surface, and defines a first aperture that exposes the contact pad. The electrically conductive layer is disposed adjacent to the first dielectric layer and is electrically connected to the contact pad through the first aperture. The second dielectric layer is disposed adjacent to the electrically conductive layer.

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Kaohsiung, Taiwan

Hung-Jen Yang