Taiwan Semiconductor Manufacturing Comp. Ltd.

TSMC China Company Limited

TSMC Nanjing Company, Limited

Hung-Jen Liao

Yen-Huei Chen

Jonathan Tsung-Yung Chang

Hidehiro Fujiwara

Cheng Hung Lee

Chih-Yu Lin

Hau-Tai Shieh

Chiting Cheng

Hsien-Yu Pan

Wei Min Chan

Hong-Chen Cheng

Cheng-Hung Lee

Mahmut Sinangil

Yu-Hao Hsu

Li-Wen Wang

Sahil Preet Singh

Wei-Cheng Wu

Ching-Wei Wu

Shao-Yu Chou

Chien-Yuan Chen

Yangsyu Lin

Jung-Hsuan Chen

Jhon Jhy Liaw

Ping-Wei Wang

Fu-An Wu

Wei-Min Chan

Tzu-Kuei Lin

Chen-Lin Yang

Kao-Cheng Lin

Hua-Hsin Yu

Li-Chun Tien

Yi-Tzu Chen

Chien-Chen Lin

Jhon-Jhy Liaw

Jung-Ping Yang

Yen-Ting Lin

Pankaj Aggarwal

Chien-Kuo Su

Chi-Ting Cheng

Jui-Jen Wu

Yung-Lung Lin

Chung-Ji Lu

Haruki Mori

Tsung-Yung Chang

Manish Arora

Nikhil Puri

Yasutoshi Okuno

Kun-Lung Chen

Tsung-Hsien Huang

Dao-Ping Wang

Chun-Jiun Dai

Lee-Chung Lu

Derek C Tao

Sung-Chieh Lin

Chia-Chen Kuo

Che-Ju Yeh

Ming-Yi Lee

Zhi-Hao Chang

Yen-huei Chen

Chen Yen-Huei

Chung-Hsing Wang

Chung-Cheng Chou

Kuo-Hua Pan

Yun-Han Lee

Jui-Che Tsai

Tze-Chiang Huang

He-Zhou Wan

Yuh-Jier Mii

Annie-Li-Keow Lum

Michael Patrick Clinton

Hsu-Shun Chen

XiuLi Yang

You-Cheng Xiao

Bin-Hau Lo

Jihi-Yu Lin

Chien Chi Tien

Chao Kai Chuang

Yen-Chien Lai

Yih Wang

Fu-Lung Hsueh

Jack Liu

Feng-Ming Chang

Chung-Yi Wu

Huai-Ying Huang

Chia-Wei Wang

Ming-Hsien Tsai

Chih-Chieh Chiu

Yi-Hsin Nien

Jiann-Tseng Huang

Simon Wang

Hsin-Hsin Ko

Kun Lung Chen

Uppu Sharath Chandra

Fu-Chieh Hsu

Lee Cheng Hung

Shu-Hsuan Lin

A semiconductor device includes a first memory array, a first bit line, a second memory array, a second bit line, a first conductive line and a first control circuit. The first bit line crosses over and is coupled to the first memory array, and extends along a first direction. The second bit line crosses over the second memory array, and is coupled to the first bit line. The first conductive line crosses over the second memory array and a part of the first memory array, and is configured to operate as a part of a first capacitor. The first control circuit is configured to couple the first conductive line to the second bit line when the first memory array is written.

Semiconductor device

A semiconductor device includes a first memory bank, a second memory bank and a first write driver. The first memory bank is coupled to a plurality of first data lines, and configured to operate according to a first data signal. The second memory bank is configured to operate according to the first data signal. The first write driver is disposed between the first memory bank and the second memory bank, and configured to adjust a voltage level of one of the plurality of first data lines when the first memory bank is written according to the first data signal.

A semiconductor memory device includes: a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; a column of segments, each segment including bit cells; each of the bit cells being coupled correspondingly between the LWB and LWB_bar lines; and a distributed write driving arrangement including local write drivers correspondingly coupled to the segments; and a global write driver coupled to each of the local write drivers.

Semiconductor device including distributed write driving arrangement

A memory circuit includes a first pull down transistor, a first pass gate transistor coupled to the first pull down transistor, a second pull down transistor, a second pass gate transistor and a first metal contact. The second pull down transistor has a first active region located on a first level. The second pass gate transistor has a second active region located on the first level, and being coupled to the second pull down transistor. The first metal contact extends from the first active region to the second active region, being located on a second level, and electrically coupling a drain of the second pull down transistor to a drain of the second pass gate transistor. The first pass gate transistor, the second pass gate transistor, the first pull down transistor and the second pull down transistor are part of a four transistor (4T) memory cell.

Memory array circuit and method of manufacturing same

A device is provided and includes a sense amplifier and an output latch circuit. The sense amplifier adjusts voltage levels of first and second data lines according to a bypass data signal corresponding to a data signal in response to a first enable signal having a first logic state and a second enable signal having a second logic state different from the first logic state during a test mode. The output latch circuit generates a data output signal according to the voltage level of the first data line in response to the first enable signal having the second logic state and a third enable signal having the first logic state during the test mode.

Latch type sense amplifier for testing

A method of performing an in-memory computation includes storing a first subset of data in a first segment of a first memory array and a second subset of the data in a second segment of the first memory array, latching a first data bit from a first column of memory cells in the first segment of the first memory array, sequentially reading a plurality of second data bits from a second column of memory cells in the second segment of the first memory array, and performing a logic operation on each combination of the latched first data bit and each second data bit.

Memory computation method

A memory device and a method of operating the same are disclosed. In one aspect, the memory device includes a plurality of memory arrays and a controller including a plurality of buffers including a first buffer connected to a first memory array and a second buffer connected to a second memory array. The first and second memory arrays are disposed on opposing sides of the controller. The memory device can include a first wire extending in a first direction and connected to the first buffer, a second wire extending in the first direction and connected to the second buffer, and a third wire connected to the first and second wires and extending in a second direction that is substantially perpendicular to the first direction. The third wire can be electrically connected to the controller, and respective lengths of the first wire and the second wire are substantially the same.

Arrangements of memory devices and methods of operating the memory devices

Disclosed herein are related to an integrated circuit to regulate a supply voltage. In one aspect, the integrated circuit includes a metal rail including a first point, at which a first functional circuit is connected, and a second point, at which a second functional circuit is connected. In one aspect, the integrate circuit includes a voltage regulator coupled between the first point of the metal rail and the second point of the metal rail. In one aspect, the voltage regulator senses a voltage at the second point of the metal rail and adjusts a supply voltage at the first point of the metal rail, according to the sensed voltage at the second point of the metal rail.

Voltage regulator with power rail tracking

A latch formed from a memory cell includes a clock input terminal configured to receive a clock signal, complementary first and second data terminals, and a latch circuit. The latch circuit has first and second inverters. The first inverter has an input terminal coupled to the first data terminal, and the second inverter has an input terminal coupled to the second data terminal. A first pass gate transistor is coupled between an output terminal of the second inverter and the first data terminal. A second pass gate transistor is coupled between an output terminal of the first inverter and the second data terminal. The first and second pass gate transistors each have a gate terminal coupled to the clock input terminal. The input terminal of the first inverter is not directly connected to the output terminal of the second inverter, and the input terminal of the second inverter is not directly connected to the output terminal of the first inverter.

Latch circuit formed by modified memory cells

An integrated circuit (IC) die includes first through third adjacent rows of through-silicon vias (TSVs), and first and second adjacent rows of memory macros. TSVs of the first row of TSVs extend through and are electrically isolated from memory macros of the first row of memory macros. TSVs of the third row of TSVs extend through and are electrically isolated from memory macros of the second row of memory macros.

Integrated circuit die with memory macro including through-silicon via and method of forming the same

In one embodiment, a static random access memory (SRAM) device is provided. The SRAM device includes a memory cell, a bit line couple to the memory cell, a voltage supply line coupled to the memory cell, a control circuitry. The control circuitry is configured to charge a voltage supply line while the voltage supply line is electrically isolated from a bit line. A portion of the charge is transferred from the voltage supply line to the bit line. The voltage supply line is recharged while the voltage supply line is electrically isolated from the bit line storing the transferred portion of the charge. The memory cell is accessed using the recharge on the voltage supply line.

Pre-charging bit lines through charge-sharing

Circuit devices, such as integrated circuit devices, are constructed with combination circuits that include two or more cascading transistors, and one or more metal layers disposed over the cascading transistors. The cascading transistors include multiple internal nodes (e.g., common source/drain regions). The multiple internal nodes are not connected to a common metal stripe (the same metal stripe) in the one or more metal layers. The absence of the connections between the internal nodes and a common metal stripe reduce or eliminate the load on the internal nodes. The transistors in the cascading transistors are independent of each other.

Reducing internal node loading in combination circuits

Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Sub-word line driver placement for memory device

A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.

Latch type sense amplifier

A device includes first and second gate electrodes, a word line and a first metal island. The first gate electrode corresponds to transistors of a memory cell. The second gate electrode is separated from the first gate electrode and corresponds to the transistors. The word line is coupled to the memory cell and located between the first and the second gate electrodes. The first metal island is configured to couple a first power supply to the memory cell. A first boundary of the first metal island is located between first and second boundaries of the first gate electrode and is located between first and second boundaries of the word line, and each of the first boundary of the first gate electrode and the first boundary of the word line is located between first and second boundaries of the first metal island.

SRAM cell word line structure with reduced RC effects

Growing community of inventors

Hsinchu, Taiwan

Hung-Jen Liao