Innolux Corporation

Innocom Technology(shenzhen) Co., Ltd.

Hung-I Tseng

Ker-Yih Kao

Chia-Chi Ho

Ming-Yen Weng

Chia-Ping Tseng

Huei-Ying Chen

Shu-Ling Wu

Tzu-Yen Chiu

Yu-Jen Chang

Ching-Wei Chen

Li-Wei Sung

Yi-Hung Lin

I-Yin Li

Chuan-Ming Yeh

Heng-Shen Yeh

Chun-Chin Fan

Yao-Jen Ou

Chien-Chih Wang

Han-Lang Lee

Charlene Su

Kuo-Chun Lo

An electronic device includes a first metal layer, a first insulating layer, a second metal layer and a second insulating layer. The first insulating layer is disposed on the first metal layer, the second metal layer is disposed on the first insulating layer, and the second insulating layer is disposed between the second metal layer and the first insulating layer. The second metal layer is electrically connected to the first metal layer through a first opening of the first insulating layer and a second opening of the second insulating layer.

Electronic device having a silane coupling agent in an insulating layer

A method for manufacturing a composite layer circuit structure of an electronic device is provided. First, a first conductive layer is formed on a carrier plate. Next, a first photoresist layer is formed on the first conductive layer. The first photoresist layer includes multiple first openings exposing part of the first conductive layer. Next, a first electroplating layer is formed in the first openings. Then, the first photoresist layer is removed. Then, a first insulating layer is formed on the first conductive layer. The first insulating layer includes multiple second openings exposing part of the first electroplating layer. In the above, at least one heat treatment process is performed on the first electroplating layer before the first insulating layer is formed on the first conductive layer. A temperature when performing at least one heat treatment process is higher than or equal to 40° C. and lower than or equal to 300° C.

Method for manufacturing composite layer circuit structure of electronic device

An electronic device is provided. The electronic device includes a first substrate, an insulating layer, a first conductive layer and a second conductive layer. The insulating layer is overlapped with the first substrate. The second conductive layer contacts with the first conductive layer. The first conductive layer and the second conductive layer are disposed between the first substrate and the insulating layer. The second conductive layer is disposed between the first conductive layer and the insulating layer. Moreover, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the insulating layer.

Electronic device

A manufacturing method of a package structure of an electronic device, including the following steps, is provided. A first seed layer is formed on a carrier plate. A first metal layer is formed on the first seed layer. A first insulating layer is formed on the first metal layer, wherein the first insulating layer exposes a portion of the first metal layer. A first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer. After performing the first plasma treatment, the carrier plate formed with the first seed layer, the first metal layer, and the first insulating layer is placed in a microenvironment controlling box. After taking the carrier plate out of the microenvironment controlling box, a second seed layer is formed on the first insulating layer and the exposed portion of the first metal layer.

Manufacturing method of package structure of electronic device

An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.

An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.

Electronic device and antenna device

A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.

Microwave modulation device

A photo-alignment apparatus is provided, which includes an exposure machine, at least one mask and a photo-alignment area. The exposure machine includes a light source, a polarization plate, and a multilayer splitter. The light source emits an unpolarized light. The polarization plate receives the unpolarized light and converts the unpolarized light into a polarized light. The multilayer splitter split the polarized light into a first light beam and a second light beam. The mask includes at least two transmission portions which allow the first and second light beams to be transmitted therethrough and be projected onto the photo-alignment area for exposure thereto.

Photo-alingment apparatus, and method for fabricating liquid crystal display

A method of forming an alignment film is provided. A photosensitive polymer material is provided, wherein the photosensitive polymer material defines a first pixel area and a second pixel area respectively defining a first sub-pixel area and the second sub-pixel area. In a first exposure, the photosensitive polymer material is irradiate by a first exposure light and a second exposure light to form a first alignment portion and a second alignment portion with different alignment directions in the first sub-pixel of the first pixel area and the second sub-pixel of the second pixel area respectively. In a second exposure, the photosensitive polymer material is irradiated with the first exposure light and the second exposure light to form a third alignment portion and a fourth alignment portion with different alignment directions in the first sub-pixel of the second pixel area and the second sub-pixel of the first pixel area respectively.

Growing community of inventors

Miao-Li County, Taiwan

Hung-I Tseng