Advanced Semiconductor Engineering, Inc.

Hung-I Lin

Kuei-Hao Tseng

Ming-Tau Huang

Chih Lung Lin

Kai Hung Wang

Te Kao Tsui

A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Semiconductor device package and acoustic device having the same

The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.

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Kaohsiung, Taiwan

Hung-I Lin