Industrial Technology Research Institute

Hung-Hsien Ko

I-Hung Chiang

Cheng-Ta Pan

Cheng-Chung Lee

Wen-Yung Yeh

Yu-Lin Hsu

Te-Hsun Lin

Hao-Wei Yu

Heng-Yin Chen

Kuo-Hua Tseng

Chen-Tsai Yang

Chang-Ying Chen

Yi-Cheng Lu

Min-Hsiung Liang

Ting-Yu Wang

Ting-Yu Ke

A flexible hybrid electronic substrate and electronic textile including the same are provided. The flexible hybrid electronic substrate includes a first region and a second region. There is a joint between the first region and the second region. Each of the first region and the second region includes at least one selected from the group consisting of the following structure features: multilayer structure feature, anisotropic structure feature and pre-strained structure feature.

Flexible hybrid electronic substrate and electronic textile including the same

Provided are a circuit apparatus, a manufacturing method thereof, and a circuit system. The circuit apparatus includes a flexible circuit board, a flexible packaging material layer and an electronic device. The flexible circuit board has at least one hollow pattern, wherein the flexible circuit board has an inner region and a peripheral region surrounding the inner region, and has a first surface and a second surface opposite to each other. The flexible packaging material layer is disposed in the at least one hollow pattern. The electronic device is disposed on the first surface of the flexible circuit board and electrically connected with the flexible circuit board.

Circuit apparatus, manufacturing method thereof and circuit system

A stretchable circuit is provided in the invention. The stretchable circuit comprises a plurality of segments. Each segment includes a plurality of sub-segments. Each sub-segment includes at least one main line, at least one secondary line, and rib lines, and in each sub-segment, the main lines and the secondary lines are electrically connected to the rib lines.

Stretchable circuit and layout method for stretchable circuit

A stress measuring device and a stress measuring method for measuring a stress distribution of an object are provided. The stress measuring method includes: receiving a first-dimension image of the object; marking an area of the first-dimension image to generate a marked area; calculating a first stress applied to the marked area and transforming the marked area to a strained marked area corresponding to a second-dimension image to generate a determination result; and calculating the stress distribution corresponding to the first-dimension image of the object according to the determination result.

Stress measuring device and stress measuring method

A strain measurement method includes disposing a 3D camera module at a first measurement position; using the 3D camera module to acquire a first 3D image of a to-be-measured object at a first to-be-measured position; acquiring a second 3D image of the to-be-measured object at the first to-be-measured position; and splicing the first and second 3D images to obtain an initial 3D image. The method still includes: moving the 3D camera module from the first measurement position to a second measurement position; using the 3D camera module to acquire a third 3D image of the to-be-measured object at a second to-be-measured position; acquiring a fourth 3D image of the to-be-measured object at the second to-be-measured position; and splicing the third and fourth 3D images to obtain a deformed 3D image. The method further includes comparing the initial 3D image and the deformed 3D image to output 3D deformation information.

Strain measurement method and strain measurement apparatus

A stretchable electronics generating apparatus and layout method thereof are provided. The layout method includes: establishing a layout database, wherein the layout database recodes a plurality of layout selection information respectively corresponding to a plurality of strain/stress information; detecting a layout target area to obtain a strain/stress distribution status of the layout target area; generating a wire routing information according to the strain/stress distribution status based on the layout database; and transporting the wire routing information to a manufacture device of the conductive wires for disposing a plurality of physical conductive wires on the layout target area by the manufacture device.

Growing community of inventors

Hsinchu County, Taiwan

Hung-Hsien Ko