United Microelectronics Corp.

Hung-Hsien Chang

Eric Chu

Wei-Hua Fang

Yung-Chin Yen

Hsing-Sheng Yang

Chine-Li Wang

To-Yao Hsu

Chun-Yen Chen

Chin-Wen Chung

A method for fabricating a semiconductor device, wherein the method comprises steps as follows: Firstly, a device wafer is provided and a patterned bonding layer is then formed within a scribe line region of the device wafer. Subsequently a handle wafer is bonded to the device wafer by the patterned bonding layer. Next, a dicing process is performed along the scribe line region in order to divide the device wafer into a plurality of dices and remove the patterned bonding layer simultaneously, whereby the divided dices can be separated from the handle wafer.

Method for fabricating semiconductor device

A cassette holder is positioned within cleaning equipment. The cleaning equipment includes a solution tank, at least one pipe positioned on an internal wall of the solution tank, and a cassette in which at least one semiconductor wafer is placed. The cassette holder has a loading plate in the solution tank for holding the cassette. Pluralities of guide blocks mounted on the loading plate prevent movement of the cassette. A side-frame is positioned at an end of the loading plate proximate to the pipe. The bottom of the loading plate has a plurality of neck feet, and each neck foot is covered by a first tube that enhances support strength of the neck foot. The cassette holder further includes at least one weight to overcome buoyancy.

Cassette holder for cleaning equipment

Growing community of inventors

Changhua County, Taiwan

Hung-Hsien Chang